A -- WIDE BANDGAP SEMICONDUCTOR TECHNOLOGY INITIATIVE DAY

Notice Date

August 21, 2001

Contracting Office

Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, VA, 22203-1714

ZIP Code

22203-1714

Description

The DARPA Microsystems Technology Office (DARPA/MTO) will host a one-day, unclassified briefing of the planned Wide Bandgap Semiconductor Technology Initiative for interested representatives of U.S. Government and the U.S. technical community only. The Briefing to Industry will be held on September 5, 2001 from 0830 to 1700, at the Sheraton Premiere Tyson's Corner, 8661 Leesburg Pike, Vienna, VA 22182. (Attendee check-in will open at 0700, 5 Sept 01, at the conference site.) The initiative is a planned DARPA effort aiming at the development of wide bandgap semiconductors materials, devices, and integrated circuits to enable revolutionary concepts for radio frequency (RF) systems and novel approaches for high power electrical control and conversion. This initiative will focus on the following technical areas: (a) substrate technology, (b) epitaxial material technologies, (c) device and integrated circuit technnologies, and (d) the development of electronic integration assemblies suitable for high power, high voltage applications. (For details of the planned Wide Bandgap Semiconductor Technology Initiative, see CBD notice entitled, "BAA 01-35 Wide Bandgap Semiconductor Technology Initiative.") The intent of hosting an Industry Day conference is to inform the technical community of the government plans and related activities to DARPA's Wide Bandgap Semiconductor Technology Initiative. Organizations wishing their representatives to attend the Briefing to Industry should submit attendance requests, via e-mail, to the Defense Advanced Research Projects Agency (DARPA), Attn: Ms. Angela Lee, Booz-Allen and Hamilton, e-mail: alee@snap.org. Interested organizations may also respond via on-line registration: http://www.DavinciNetBook.com/conference using code WID82507. Organizations will be limited to a maximum of 5 representatives each. Registration application must be received no later than (NLT) 30 Aug 01. Registrations will be confirmed via e-mail NLT 31 Aug 01. Each individual must submit the following information: last name, first name, business title, organization, full street address, city, state, zip code, telephone number, fax number and e-mail address. Each organization should specify a single point of contact for Industry Day registration issues. Individuals must procure their own hotel accommodations which can be made at the Sheraton Premiere Tyson's Corner, 8661 Leesburg Pike, Vienna, VA 22182 at (703) 448-1234, if desired. A conference registration fee of $85.00 per individual must be paid at the conference site or on-line. Each individual will make checks payable to Booz-Allen & Hamilton, Inc., (703) 465-2633, e-mail: alee@snap.org or alee@bah.com; or Mr. Jonathan Breedlove, Booz-Allen and Hamilton, Inc., (703) 465-2625, e-mail: breedlove_jonathan@bah.com. Technical POC: Mr. Chun Lau (lau_chun@bah.com), Booz-Allen & Hamilton, Inc. WEB: click here to download a copy of the special notice, www.darpa.mil/baa/#mto. Posted 08/21/01.

Web Link

Visit this URL for the latest information about this (http://www.eps.gov/spg/ODA/DARPA/CMO/SN01-18/listing.html)

Record

Loren Data Corp. 20010823/SPMSC009.HTM (D-233 SN50V5T7)