A -- INTELLIGENT RF FRONT-ENDS

Notice Date

June 28, 2001

Contracting Office

Defense Advanced Research Projects Agency (DARPA), Contract Management Office (CMO), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

ZIP Code

22203-1714

Solicitation Number

BAA01-33

Response Due

October 18, 2001

Point of Contact

Dr. Edgar J. Martinez, DARPA/MTO, Fax (703) 696-7436

E-Mail Address

BAA01-33@darpa.mil (BAA01-33@darpa.mil)

Description

DARPA is soliciting innovative research proposals in the area of Intelligent Radio Frequency (RF) Front-ends, a comprehensive five year initiative aimed at developing a new generation of highly adaptable, highly intelligent, high performance, RF/analog microsystems technology based on mixed-signal concepts. The objective of this effort is to develop and demonstrate revolutionary concepts in devices, fabrication processes, component architectures, and integration technologies to produce highly adaptable, highly integrated analog microwave and or millimeter-wave circuits and components. An Intelligent RF Front-End microsystem is defined as a passive and/or active, highly integrated RF/analog component with the ability to self-assess and adapt itself to meet changing functional requirements or environmental conditions (adjust its performance in real time), by automatic self-tuning its impedance-matching networks. This adaptability characteristic will allow extension of the operational performance of the component to the intrinsic semiconductor device limits. A potential candidate approach takes advantage of the precision and performance of III-V compound semiconductors, the integration and complexity of high speed silicon technologies, and the actuation properties of micro-electro-mechanical (MEMS) devices to demonstrate these highly intelligent, highly integrated (systems-on-a-chip, systems-on-a-wafer, or systems-in-a-package), analog/RF front-end Microsystems. For example, RF MEMS switches, tunable structures, and multi-GHz silicon digital integrated circuit technology can be used to tailor the performance properties of microwave and/or millimeter wave millimeter wave monolithic integrated circuits (MMICs) including self-assessment, control and optimization of the RF/analog functions. Currently, a MMIC that incorporates inherently wideband active devices (active core) such as metal semiconductor field effect transistors (MESFETs), high electronic mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs) operated as an amplifier, has an instantaneous bandwidth, power output and power added efficiency that is limited by its fixed input and output matching structures. Tunable matching structures could be realized by integrating conventional passive components with electronically-tuned reactance elements (i.e. micro-electro-mechanical, MEMS devices). The use of ultra-high speed silicon logic circuitry will allow these tunable matching structures to be adjusted almost instantly to achieve performance breakthroughs such as, the ability to provide high output power over octaves of bandwidth, optimize power added efficiency at different frequencies, and optimize the component performance and output characteristics as a result of instantaneous changes in operational bandwidth. The proposed research activity is expected to include investigation of innovative approaches that enable revolutionary advances in highly adaptable, highly integrated analog, microwave, and/or millimeter-wave integrated circuits, components, and microsystems technologies. Specifically excluded are those research activities that primarily result in evolutionary improvements to the existing state of practice of MMICs or analog and mixed signal component technologies. Teaming is encouraged and the viability of teaming arrangements should be clearly explained in the proposal abstracts and full proposals. Emphasis will be placed on integrated approaches, i.e., integrated teams formed to better address the many different technological and scientific aspects of the Intelligent RF Front-Ends program. For example, areas of expertise that should be incorporated into these teams include analog, microwave and millimeter-wave devices integrated circuits (ICs), digital very large scale integrated circuit (VLSI) technology, digital control techniques, MEMs, electronic integration, system applications, etc. Teaming between industries, universities, and/or federal and national laboratories with complementary areas of expertise is strongly encouraged. While innovative proposals from individuals or small groups will also be considered, a website https://www.davincinetbook.com/ife will be established to facilitate teaming between interested parties. Specific information content, communications, networking, and team formation are the sole responsibilities of the participants. Neither DARPA nor the Department of Defense (DoD) endorses the destination website or the information and organizations contained therein, nor does DARPA or the DoD exercise any responsibility at the destination. This website is provided consistent with the stated purpose of this BAA. This effort has two phases. Phase I is the concept demonstration phase with a maximum duration of thirty-six months. Phase II is an advanced Intelligent RF microsystem demonstration phase with a duration of twenty-four months. This announcement is soliciting proposals addressing the Phase I effort only. Proposals for the Phase II effort will be solicited at a future date depending on the successful completion of the Phase I effort and the availability of funds. DARPA seeks innovative proposals in the following areas: (a) Concept study, (b) Active self-assessment and optimized control of RF/analog functions, (c) Real-time adaptation, and (d) Demonstration of digital control of analog circuits concept. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 01-33 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Awards totaling approximately $35 million over three years are expected to be made during the first half of calendar year 2002. Multiple awards are anticipated. Collaborative efforts/teaming are encouraged. Cost sharing is encouraged where there is reasonable probability of a potential commercial application related to the proposed research and development effort. The technical POC for this effort is Dr. Edgar J. Martinez, fax: (703) 696-2206, electronic mail: BAA01-33@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled "BAA 01-33, Intelligent RF Front-ends, Proposer Information Pamphlet" which provides further information on adaptable highly integrated RF/analog components, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and no more than nine (9) copies of the proposal abstract must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 01-33) on or before 4:00 p.m., local time, Monday, August 13, 2001. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and nine (9) copies of the full proposal to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 01-33) on or before 4:00 p.m., local time, Thursday October 18, 2001, in order to be considered. This notice, in conjunction with the BAA 01-33 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in adaptable highly integrated RF/analog components. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 01-33. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 696-2206 (Addressed to: DARPA/MTO, BAA 01-33), Electronic Mail: BAA01-33@darpa.mil, Mail: DARPA/MTO, ATTN: BAA 01-33, 3701 North Fairfax Drive, Arlington, VA 22203-1714, This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area.

Web Link

click here to retrieve a copy of the Proposer Information (http://www.darpa.mil)

Record

Loren Data Corp. 20010702/ASOL002.HTM (W-179 SN50Q3R3)