66 -- MASK AND BOND ALIGNER

Notice Date

June 11, 2001

Contracting Office

U.S. Army, Robert Morris Acquisition Center, AMSSB-ACA-C, 2800 Powder Mill Road, Adelphi, MD 20783-1197

ZIP Code

20783-1197

Solicitation Number

W71B7J-1120-M181

Response Due

June 29, 2001

Point of Contact

Kathy Brown, Contract Specialist, 301-394-4012 Contracting Officer: Bob Tomko, 301-394-3691

Description

The Army Research Laboratory (ARL) intends to solicit on a sole source basis to Karl Suss America, Inc for a Model MA6/BA6 Mask and Bond Aligner with microprocessor control. The MA6/BA6 Mask and Bond Aligner is required to substrates for subsequent wafer-to-wafer bonding with our existing Karl Suss SB6 substrate Bonder. The alignment process is necessary for fulfilling the MEMS mission at ARL; the substrates are precisely aligned, on-to-the-there, in the MA6/BA6 mask/bond aligner using chucks and fixtures that are specific to our existing Karl Suss SB6 Substrate Bonder. Karl Suss MA6/BA6 is required to maintain compatibility with existing photolithography and wafer-to-wafer bonding tools at ARL. Karl Suss is Original Equipment Manufacture. All responsible sources may submit a capability statement. To request a copy of the solicitation package send a request to rmac-adelphi@arl.army.mil with "Brown -- " in the subject line. No telephone request will be honored. See Numbered Notes: 22

Record

Loren Data Corp. 20010613/66SOL005.HTM (W-162 SN50O5C3)