66 -- REACTIVE ION ETCH SYSTEM

Notice Date

May 11, 2001

Contracting Office

US Army Materiel Command Acquisition Center, Army Research Laboratory Contracting Division, Attn: AMSSB-ACA-P, 2800 Powder Mill Road, Adelphi, Maryland 20783-1197

ZIP Code

20783-1197

Solicitation Number

DAAD17-01-T-9495

Response Due

June 11, 2001

Point of Contact

Kathy Brown, Contract Specialist, 301-394-4012 Contracting Officer, Bob Tomko, 301-394-3691

Description

The Army Research Laboratory is soliciting on a brand name or equal basis for a Reactive Ion Etch System with Inductively Coupled Plasma source. The brand name product is a Minilock II Reactive Ion Etch System manufactured by Trion Technology, 1025 South 52nd Street, Tempe, AZ 85281. The salient characteristics of the system are: (a) Capable of etching the following materials in stack and/or separately: lead zirconate titanate [Pb(ZrXTI1-X )03 , typically with x= 0.52], silicon dioxide (SiO2), silicon nitride (Si3N4), and platinum (Pt). (b) Be able to provide deep etching (down to 5 micrometers) SiO2 and Si3N4, and provide SiO2:Si and Si3N4:Si etch selectivities of at least 100. (c) Demonstrated etching capability using photoresist patterned samples. (d) Provide anisotropic etch profiles for feature sizes down to 2 micrometers. Be able to etch with mask thicknesses up to 5 micrometers. (e) Uses environmentally friendly gases. (f) Must meet a size limitation of 45" high x 20" wide x 51" deep. To request a copy of the solicitation package send a request to rmac-adelphi@arl.army.mil with "Brown -- 01-T-0405" in the subject line. No telephone request will be honored. See Numbered Notes: 1.

Record

Loren Data Corp. 20010515/66SOL007.HTM (W-131 SN50L944)