Defense Advanced Research Projects Agency (DARPA), Contract Management Directorate (CMD), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- 3-DIMENSIONAL ELECTRONICS PACKAGING POC Scott R. Ulrey, DARPA/CMD, Fax (703) 696-2208 The Defense Advanced Research Projects Agency (DARPA) intends to negotiate a cost-plus-fixed-fee contract with Northrop Grumman Corporation's Electronic Sensors and Systems Sector to provide research and development in the 3-Dimensional (3-D) Electronics Packaging area. Northrop Grumman and its team of subcontractors are proposing to develop technologies for 3-D packaging of high performance electronics. This compact packaging concept consists of high density Z-axis interconnects and low cost, high thermal conductivity diamond substrates as heat-spreaders. DARPA believes that contracting without providing for full and open competition is justified in accordance with FAR 6.302-1 in order to acquire highly specialized services deemed available only from the original source without duplicating costs or incurring unacceptable delays. Duration of this effort will be 24 months. See Numbered Notes 22, 25, and 26. Posted 03/22/99 (W-SN311042). (0081)

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