REMOVABLE POLYURETHANE ENCAPSULANTS Sandia National Laboratories has developed a polyurethane encapsulant resin, which is removable at modest elevated temperature. This encapsulant system can be used to encase items, such as microelectronics components, to provide protection from adverse environments and then gently removed if desired. Removability may be desired in order to be able to repair, maintain, or upgrade the encapsulated component. Applications Removable foams for light-weight protection Rapid on-board component replacement Potential Benefits Creates new thermoplastics from traditional thermosets, providing more versatile processing. Could reduce costs by allowing for single component replacements rather than total system replacements. Can provide temporary protection during shipping. Can reduce costs by potential reuse of the encapsulant material. New reversible/removable adhesive applications. References A patent application is being applied for this technology. Partnership Opportunity Sandia National Laboratories is looking for a U.S. industrial partner to further develop this technology. An opportunity for an exclusive license in limited fields of use is possible to a U.S. industrial partner which meets a number of requirements including: entering into a multiyear CRADA agreement with Sandia National Laboratories and providing funds into Sandia at a level of at least $400k. Interested U.S. companies must respond to this notice by February 15, 1999 in order to be considered. For further information, please respond by mail or fax to Joanne Trujillo no later than February 15, 1999 at: Sandia National Laboratories, MS 1380, P. O. Box 5800, Albuquerque, New Mexico 87185-1380. Fax: (505) 843-4175. Please indicate the date and title of this CBD notice. E-MAIL: Joanne Trujillo, jmtruji@sandia.gov. Posted 02/01/99 (W-SN293483).

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