FLIP CHIP UNDERFILL STUDIES Sandia National Laboratories has conducted leading edge studies of the flow of flip chip underfill materials and development of simple tools to characterize flow properties. Significant expertise in understanding adhesive systems and in actual bonding for mfg. and research applications. The use of modeling and proprietary codes in conjunction with fundamental encapsulation studies to understand nature of encapsulant filling, cure, and internal stress generation. JKR apparatus, dynamic and static contact angle equipment, fracture mechanics measurement techniques imaging apparatus with micron level and 30 frames/sec recording capabilities, techniques for measuring highly filled polymer flow and cure in thin gap (10 microns) structures, dynamic mechanical analyzer, thermal analysis techniques. PC-based model for use by formulators and process engineers in working on processes. Important applications include: Electronic packaging/underfill (flip chip). Materials formulators. Potential Benefits Improved understanding of the behavior of highly filled epoxy flow in 10-100 micron gaps is required to meet the conflicting materials requirements necessary for an effective underfill. Shorter product development time due to Sandia's expertise and proven track record in product development. Demonstrated Achievements Developed tools for SEMATECH for use in characterizing flow of underfill materials. Developed imaging system for viewing the flow during underfill. Follow-up This proprietary Sandia capability may be applied to solve challenging problems in the field of polymer and other organic sciences. Sandia has the flexibility to form specific teams of technical experts from any or all of the above capabilities to focus expertise on specific technical challenges. We are interested in making this technology available to companies responsive to partnering with Sandia to develop near/term and/or future applications via licensing or cooperative development agreements. For further information, please respond by mail or fax to Joanne Trujillo no later than December 9, 1998 at: Sandia National Laboratories, MS 1380, P. O. Box 5800, Albuquerque, New Mexico 87185-1380. Fax: (505) 843-4163. Please indicate the date and title of this CBD notice. E-MAIL: Joanne Trujillo, jmtruji@sandia.gov. Posted 11/25/98 (W-SN274873).

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