Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 N. Fairfax Dr., Arlington VA 22203-1714

A -- ADVANCED MICROELECTRONICS SOL BAA 97-07 DUE 021497 POC R.F.W. Pease, DARPA/ETO, Fax (703) 696-2206. The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of advanced microelectronics technologies. The goal of this program is to revolutionize semiconductor integrated circuits through the research of the innovative processes, materials, and manufacturing techniques. Specifically excluded are research efforts that primarily result in evolutionary improvements to present state-of-practice. Research plans that include a mid-term validation of progress are desirable. PROGRAM OBJECTIVES AND DESCRIPTION: The objective of the DARPA Advanced Microelectronics Program is to revolutionize and accelerate the progress towards future semiconductor generations (e.g. scales of integration corresponding to one trillion (1e12) transistors per chip (''tera-scale integration'')). Technology approaches that involve many layers of active devices as well as features in the size range of 25nm and below are of greatest interest. Also of interest are high throughput patterning technologies that simplify processes by eliminating masks or by minimizing or eliminating resists and resist processing. DARPA seeks innovative proposals in the following areas: I. 25nm-scale active devices, II. High-speed nm-scale patterning, III. Fabrication of multiple layers of active devices, and IV. Interconnection of active devices. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 97-07 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Multiple awards totalling approximately $50 million over the next four years are expected to be made. Collaborative efforts/teaming and cost sharing are encouraged. The technical POC for this effort is Dr. R. Fabian Pease, fax: (703) 696-2206, electronic mail: fpease@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled ''BAA 97-07, Advanced Microelectronics, Proposer Information Pamphlet'' which provides further information on areas of interest, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and eight (8) copies must be submitted to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-07) on or before 4:00 P.M., Wednesday, December 18, 1996. Proposal abstracts received after this time and date will not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers who choose not to submit a proposal abstract must submit an original and eight (8) copies of the full proposal to DARPA/ETO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 97-07) on or before 4:00 P.M., Friday, February 14, 1997, in order to be considered for funding. This notice, in conjunction with the BAA 97-07 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals, however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in advanced microelectronics technology. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below, e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 97-07. Proposals and proposal abstracts may not be submitted by fax or e-mail, any so sent will be disregarded. DARPA encourages use of the World Wide Web (WWW) for retrieving the Program Information Package and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: l) overall scientific and technical merit, 2) potential contribution and relevance to the DARPA mission, 3) offeror's capabilities and related experience, 4) plan to validate progress, 5) plans and capability to accomplish technology transition, and 6) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/ETO, BAA 97-07), Electronic Mail: BAA 97-07@darpa.mil, Mail: DARPA/ETO, ATTN: BAA 97-07, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. (0317)

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