Federal Aviation Administration, Mike Monroney Aeronautical Center, Center Acquisition Contracting Team, AMQ-310, P.O. Box 25082, 6500 S. MacArthur Blvd., Oklahoma City, OK 73125-4929

59 -- PRINTED CIRCUIT BOARD SOL DTFA-02-95-B-50331 DUE 071395 POC Joe Smith, Contracting Officer, (405) 954-7791 2500 each, mount and solder components on the printed circuit board and conformal coat to form a complete unitized assembly per the FAA drawings, 1 each first article required to be delivered to Oklahoma City, Oklahoma 60 days after contract award, delivery of the remaining items 120 days after notice to proceed, SIC code 3672. For Minority, Women-Owned and Disadvantaged Business Enterprises: The Department of Transportation (DOT) Office of Small and Disadvantaged Business Utilization has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contacts. Loans are available under the DOT Short Term Lending Program (STLP) at prime interest rates up to $500,000 per contract to provide accounts receivable financing. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $500,000 per contract. DOT provides an 80 percent guaranty on the bond amount to a surety against losses. For further information and applicable forms concerning the STLP and Bonding Assistance Program, please call (800) 532-1169. (0137)

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