US Army CECOM, Product Integrity & Production Engineering Directorate, Fort Monmouth, NJ 07703-5000

A -- MARKET SURVEY FOR DEMONSTRATION AND TECHNOLOGY TRANSFER OF LOW TEMPERA TURE CO-FIRED CERAMIC ON METAL (LTCC-M) TECHNOLOGY FOR ELECTRONICS DUE 051595 POC Gary Salomon, Project Engineer, (908) 532-2358. This is a market survey to locate additional sources to demonstrate the use of low temperature co-fired ceramic on metal (LTCC-M) technology for the fabrication of circuit boards and multi-chip modules, and to perform technology transfer to the merchant printed wiring board and MCM substrate industry. The specific technology to be demonstrated has been developed as part of the Advanced Research Projects Agency Application Specific Electronic Modules program, executed under U.S. Army CECOM Contract DAAB07-94-C-C009 with David Sarnoff Research Center. Critical portions of this technology are company proprietary. Detailed technical data is not available from the Army. Suppliers capable of performing this demonstration and technology transfer must so indicate by writing to Commander, CECOM, ATTN: AMSEL-LC-ED-SP (Salomon), Fort Monmouth, NJ 07703-5000. The response must include documentation that the supplier can, in fact, demonstrate and perform technology transfer of a manufacturing process that is physically and functionally equivalent to the technology created by the original developer under Contract DAAB07-94-C-C009. For additional information contact Mr. Gary Salomon at (908) 532-2358. The deadline for response to this notice is 15 May 1995. (0116)

Loren Data Corp. http://www.ld.com (SYN# 0012 19950427\A-0012.SOL)