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COMMERCE BUSINESS DAILY ISSUE OF APRIL 10,1995 PSA#1321Advanced Research Projects Agency (ARPA), Contracts Management Office
(CMO), 3701 North Fairfax Drive, Arlington, VA 22203-1714 A -- ELECTRONIC PACKAGING AND INTERCONNECTS (EP&I) SOL BAA 95-26 DUE
052695 POC Nicholas J. Naclerio, ARPA/ESTO, FAX (703) 696-2203. The
Advanced Research Projects Agency (ARPA) is soliciting innovative
research proposals in the area of Electronic Packaging and
Interconnects. Of particular interest are technologies to address the
needs of mixed signal (i.e. analog and digital) applications such as
those needed to implement compact wireless communications systems.
Outstanding proposals in other areas of electronic packaging will also
be considered. Over the last 5 years, ARPA has invested over $250
million in the development of advanced packaging technologies,
primarily Multi-chip Modules (MCMs). This investment has been targeted
principally at increasing the performance and reducing the size of
high performance digital systems. A number of important new
technologies have emerged from those investments and have helped create
a new domestic industry which is providing MCM packaging solutions to
both military and commercial systems developers. Building on those
successes, the ARPA program is now shifting its focus to the packaging
technologies that will be needed to reduce the size, and cost of mixed
signal systems while improving their performance and reliability. These
applications are increasingly important to the DoD as it becomes
necessary to distribute more information directly to the individual
soldier, munition, or weapon system. As in the case of ARPA's prior
investments in this area, ARPA is seeking to build a generic technology
base that both serves critical military needs as well as leverages the
expanding commercial market for hand held communications, navigation,
education, and entertainment products. Preference will be given to
offerors with a demonstrated track record in serving dual use markets
and proposals which support other ARPA and DoD programs requiring
compact wireless communications such as Global Mobile Information
Systems (GLOMO) and Tactical Information Assistants (TIA). Additional
information on technologies of interest and complementary ARPA programs
is provided in the Areas of Interest section of the BAA 95-26 Proposer
Information Pamphlet referenced below. PROGRAM SCOPE: Proposed efforts
should not exceed thirty-six (36) months in length. Because this
program will span multiple disciplines and capabilities, the formation
of appropriate teaming arrangements to integrate the diverse program
areas is encouraged. Cost sharing is highly desirable, especially where
large commercial market opportunities exist. Contract awards totaling
$50 million over three years are expected to be made during the second
half of calendar year 1995. Multiple awards are anticipated.
Representatives from the military services will participate in source
selection, contracting, and management of the awards. Technical POC is:
Nicholas J. Naclerio, Fax (703) 696-2203, electronic mail,
baa95-26@arpa.mil. GENERAL INFORMATION: Proposers must obtain a
pamphlet, BAA 95-26 Proposer Information Pamphlet, which provides
further information on areas of interest, the submission, evaluation,
and funding processes, proposal abstract formats, proposal formats, and
other general information. This pamphlet may be obtained by fax,
electronic mail, or mail request to the administrative contact address
given below. Proposals not meeting the format described in the
pamphlet may not be reviewed. In order to minimize unnecessary effort
in proposal preparation and review, proposers are strongly encouraged
to submit proposal abstracts in advance of full proposals. An original
and five (5) copies of the proposal abstract must be submitted to
ARPA/ESTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.:
BAA 95-26) on or before 4:00 P.M., May 19, 1995 to be considered.
Proposal abstracts received after this date may not be reviewed. Upon
review by ARPA, written feedback will be provided on the likelihood of
a full proposal being selected and the date and time for submission of
a full proposal. Proposers not submitting proposal abstracts must
submit a full proposal by 4:00 P.M., May 26, 1995, in order to be
considered. An original and ten (10) copies of the proposal must be
submitted to ARPA/ESTO, 3701 North Fairfax Drive, Arlington, VA
22203-1714 (ATTN: BAA 95-26). This notice, in conjunction with the
pamphlet BAA 95-26 Proposer Information, constitutes the total BAA. No
additional information is available, nor will a formal RFP or other
solicitation regarding this announcement be issued. Requests for same
will be disregarded. The Government reserves the right to select for
award all, some, or none of the proposals received. All responsible
sources capable of satisfying the Government's needs may submit a
proposal which shall be considered by ARPA. Historically Black Colleges
and Universities (HBCUs) and Minority Institutions (MIs) are encouraged
to submit proposals and join others in submitting proposals, however,
no portion of this BAA will be set aside for HBCU and MI participation
due to the impracticality of reserving discrete or severable areas of
research in electronic packaging and interconnects. All administrative
correspondence and questions on this solicitation, including requests
for information on how to submit a proposal abstract or proposal to
this BAA, should be directed to one of the administrative addresses
below, e-mail or fax is preferred. ARPA intends to use electronic mail
and fax for correspondence regarding BAA 95-26. Proposals and proposal
abstracts may not be submitted by fax or e-mail, any so sent will be
disregarded. EVALUATION CRITERIA: Evaluation of proposal abstracts and
proposals will be accomplished through a technical review of each
proposal using the following criteria, which are listed in descending
order of relative importance: (l) overall scientific and technical
merit. (2) potential contribution and relevance to ARPA mission, (3)
plans and capability to accomplish technology transition and
commercialization, (4) offeror's capabilities and related experience,
and (5) cost realism. Note: cost realism will only be significant in
proposals which have significantly under or over estimated the cost to
complete their effort. The administrative addresses for this BAA are:
Fax (703) 351-8616 (Addressed to: ARPA/ESTO, BAA 95-26), Electronic
Mail: BAA95-26@arpa.mil, and Mail: ARPA/ESTO, ATTN: BAA 95-26, 3701
North Fairfax Drive, Arlington, VA 22203-1714. (0096) Loren Data Corp. http://www.ld.com (SYN# 0001 19950407\A-0001.SOL)
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