Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF APRIL 10,1995 PSA#1321

Advanced Research Projects Agency (ARPA), Contracts Management Office (CMO), 3701 North Fairfax Drive, Arlington, VA 22203-1714

A -- ELECTRONIC PACKAGING AND INTERCONNECTS (EP&I) SOL BAA 95-26 DUE 052695 POC Nicholas J. Naclerio, ARPA/ESTO, FAX (703) 696-2203. The Advanced Research Projects Agency (ARPA) is soliciting innovative research proposals in the area of Electronic Packaging and Interconnects. Of particular interest are technologies to address the needs of mixed signal (i.e. analog and digital) applications such as those needed to implement compact wireless communications systems. Outstanding proposals in other areas of electronic packaging will also be considered. Over the last 5 years, ARPA has invested over $250 million in the development of advanced packaging technologies, primarily Multi-chip Modules (MCMs). This investment has been targeted principally at increasing the performance and reducing the size of high performance digital systems. A number of important new technologies have emerged from those investments and have helped create a new domestic industry which is providing MCM packaging solutions to both military and commercial systems developers. Building on those successes, the ARPA program is now shifting its focus to the packaging technologies that will be needed to reduce the size, and cost of mixed signal systems while improving their performance and reliability. These applications are increasingly important to the DoD as it becomes necessary to distribute more information directly to the individual soldier, munition, or weapon system. As in the case of ARPA's prior investments in this area, ARPA is seeking to build a generic technology base that both serves critical military needs as well as leverages the expanding commercial market for hand held communications, navigation, education, and entertainment products. Preference will be given to offerors with a demonstrated track record in serving dual use markets and proposals which support other ARPA and DoD programs requiring compact wireless communications such as Global Mobile Information Systems (GLOMO) and Tactical Information Assistants (TIA). Additional information on technologies of interest and complementary ARPA programs is provided in the Areas of Interest section of the BAA 95-26 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Proposed efforts should not exceed thirty-six (36) months in length. Because this program will span multiple disciplines and capabilities, the formation of appropriate teaming arrangements to integrate the diverse program areas is encouraged. Cost sharing is highly desirable, especially where large commercial market opportunities exist. Contract awards totaling $50 million over three years are expected to be made during the second half of calendar year 1995. Multiple awards are anticipated. Representatives from the military services will participate in source selection, contracting, and management of the awards. Technical POC is: Nicholas J. Naclerio, Fax (703) 696-2203, electronic mail, baa95-26@arpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet, BAA 95-26 Proposer Information Pamphlet, which provides further information on areas of interest, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and five (5) copies of the proposal abstract must be submitted to ARPA/ESTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN.: BAA 95-26) on or before 4:00 P.M., May 19, 1995 to be considered. Proposal abstracts received after this date may not be reviewed. Upon review by ARPA, written feedback will be provided on the likelihood of a full proposal being selected and the date and time for submission of a full proposal. Proposers not submitting proposal abstracts must submit a full proposal by 4:00 P.M., May 26, 1995, in order to be considered. An original and ten (10) copies of the proposal must be submitted to ARPA/ESTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (ATTN: BAA 95-26). This notice, in conjunction with the pamphlet BAA 95-26 Proposer Information, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by ARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals, however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in electronic packaging and interconnects. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or proposal to this BAA, should be directed to one of the administrative addresses below, e-mail or fax is preferred. ARPA intends to use electronic mail and fax for correspondence regarding BAA 95-26. Proposals and proposal abstracts may not be submitted by fax or e-mail, any so sent will be disregarded. EVALUATION CRITERIA: Evaluation of proposal abstracts and proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit. (2) potential contribution and relevance to ARPA mission, (3) plans and capability to accomplish technology transition and commercialization, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax (703) 351-8616 (Addressed to: ARPA/ESTO, BAA 95-26), Electronic Mail: BAA95-26@arpa.mil, and Mail: ARPA/ESTO, ATTN: BAA 95-26, 3701 North Fairfax Drive, Arlington, VA 22203-1714. (0096)

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