Army Research Laboratory, ATTN: AMSRL-TT-TA, 2800 Powder Mill Road, Adelphi, Maryland 20783-1197

A -- DEVELOP LOW COST HIGH RELIABILITY MICROCIRCUIT PACKAGING TECHNOLOGIES POC Tom Gher, (301) 394-4340. Army Research Laboratory seeks parties for cooperative research and development agreements to develop low cost, high reliability microcircuit packaging technologies. Low cost high reliability electronic devices are required by both DoD and industry. Reliability, to a large extent, is dependent on device damage due to the presence of ion containing moisture on the circuit surface causing corrosion or changes in electrical performance. The traditional solution to this problem is to use hermetic packaging. However, the cost effectiveness of hermetic packages is in question. The U.S. Army Research Laboratory has been experimenting with the use of hydrophobic fluids as a barrier to moisture and damaging contaminants. Work to date has shown that immersion of circuitry in the fluid reduces the corrosion rate of circuit metals; however, the application of this technology in low cost packages is yet to be demonstrated. ARL is searching for commercial entities engaged in microcircuit packaging with R&D, design, and manufacturing capabilities to push the technology from design through to the commercial marketplace. Interested parties must be willing to work with ARL to complete device design, performance analysis, market analysis, development of fabrication techniques, and commercially market the devices. A Cooperative Research and Development Agreement, authorized by the Federal Technology Transfer Act of 1986, not a contract, will be the legal instrument facilitating the relationship. Inquiries are desired by 01 March 1995. Written responses, describing company interest, commercial successes, and facilities should be mailed or faxed to Mrs. Norma Vaught, Army Research Laboratory, ATTN: AMSRL-TT-TA, 2800 Powder Mill Road, Adelphi, MD 20783-1197. The fax number is (301) 394-5818. ARL will respond to interested firms. (0034)

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