SAMDaily.us | PRESOL | 66 | Multichip Module Package for SiC Pressure Sensors

SAMDAILY.US - ISSUE OF JUNE 28, 2026 SAM #8980
SOLICITATION NOTICE

66 -- Multichip Module Package for SiC Pressure Sensors

Notice Date: 6/26/2026 4:04:10 AM
Notice Type: Combined Synopsis/Solicitation
NAICS: 334419 — Other Electronic Component Manufacturing
Contracting Office: NASA SHARED SERVICES CENTER STENNIS SPACE CENTER MS 39529 USA
ZIP Code: 39529
Solicitation Number: 80NSSC26936730Q
Response Due: 6/30/2026 5:00:00 AM
Archive Date: 07/15/2026
Point of Contact: Shanna Patterson
E-Mail Address: shanna.l.patterson@nasa.gov
(shanna.l.patterson@nasa.gov)
Description: ** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors
Web Link: SAM.gov Permalink
(https://sam.gov/workspace/contract/opp/be8e1f1156144652a73c065ffad6e328/view)
Place of Performance: Address: Cleveland, OH 44135, USA; Zip Code: 44135; Country: USA
Record: SN07866629-F 20260628/260626230044 (samdaily.us)
Source: SAM.gov Link to This Notice
(may not be valid after Archive Date)

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