SAMDaily.us | AWARD | 66 | Automated High Placement Accuracy Flip-Chip Die Bonder

SAMDAILY.US - ISSUE OF FEBRUARY 01, 2025 SAM #8467
AWARD

66 -- Automated High Placement Accuracy Flip-Chip Die Bonder

Notice Date: 1/30/2025 6:59:08 AM
Notice Type: Award Notice
NAICS: 334413 — Semiconductor and Related Device Manufacturing
Contracting Office: DEPT OF COMMERCE NIST GAITHERSBURG MD 20899 USA
ZIP Code: 20899
Solicitation Number: 1333ND25PNB030043
Archive Date: 02/13/2025
Point of Contact: Sadaf Afkhami, Phone: 3019753976
E-Mail Address: Sadaf.Afkhami@nist.gov
(Sadaf.Afkhami@nist.gov)
Award Number: 1333ND25PNB030043
Award Date: 01/29/2025
Awardee: FINETECH Mesa AZ 85210 USA
Award Amount: 643110.00
Description: Contract Award Number 1333ND25PNB030043 was made to the following: Contractor Awarded Name: FINETECH Contractor Awarded Unique Entity ID: DL8LPYERW429 Contractor Awarded Address: Mesa, AZ 85210 USA Base and All Options Value (Total Contract Value): $643,110.00
Web Link: SAM.gov Permalink
(https://sam.gov/opp/fb0c222998cc443ba5c9fb77b87c67b1/view)
Place of Performance: Address: Gaithersburg, MD 20899, USA; Zip Code: 20899; Country: USA
Record: SN07327528-F 20250201/250130230105 (samdaily.us)
Source: SAM.gov Link to This Notice
(may not be valid after Archive Date)

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