SPECIAL NOTICE
H -- Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics
- Notice Date
- 8/20/2024 5:14:32 AM
- Notice Type
- Special Notice
- NAICS
- 334419
— Other Electronic Component Manufacturing
- Contracting Office
- NASA SHARED SERVICES CENTER STENNIS SPACE CENTER MS 39529 USA
- ZIP Code
- 39529
- Solicitation Number
- 80NSSC24881222Q
- Response Due
- 8/23/2024 7:00:00 AM
- Archive Date
- 09/07/2024
- Point of Contact
- Tessa Martinez
- E-Mail Address
-
tessa.m.martinez@nasa.gov
(tessa.m.martinez@nasa.gov)
- Description
- **SOLE SOURCE REQUIREMENT** FOR Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/3c780619f5424a8d89a09358c0ae079b/view)
- Place of Performance
- Address: Cleveland, OH 44135, USA
- Zip Code: 44135
- Country: USA
- Zip Code: 44135
- Record
- SN07177308-F 20240822/240820230116 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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