SAMDaily.us | SRCSGT | 66 | Automated Flip-Chip Die Bonder

SAMDAILY.US - ISSUE OF FEBRUARY 29, 2024 SAM #8129
SOURCES SOUGHT

66 -- Automated Flip-Chip Die Bonder

Notice Date: 2/27/2024 12:36:49 PM
Notice Type: Sources Sought
NAICS: 334413 — Semiconductor and Related Device Manufacturing
Contracting Office: DEPT OF COMMERCE NIST GAITHERSBURG MD 20899 USA
ZIP Code: 20899
Solicitation Number: NIST-SS24-CHIPS-0021
Response Due: 3/13/2024 8:00:00 AM
Archive Date: 03/28/2024
Point of Contact: Jenna Bortner, Tracy Retterer
E-Mail Address: jenna.bortner@nist.gov, Tracy.retterer@nist.gov
(jenna.bortner@nist.gov, Tracy.retterer@nist.gov)
Description: Please see attachment.
Web Link: SAM.gov Permalink
(https://sam.gov/opp/da42089fdf5743e1a05944de6969f4d1/view)
Place of Performance: Address: Gaithersburg, MD 20899, USA; Zip Code: 20899; Country: USA
Record: SN06978922-F 20240229/240227230053 (samdaily.us)
Source: SAM.gov Link to This Notice
(may not be valid after Archive Date)

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