SAMDaily.us | PRESOL | A | MPA2 Wafer Thinning, Dicing, Pick-and-Place, and Optional Die Tracing

SAMDAILY.US - ISSUE OF SEPTEMBER 29, 2023 SAM #7976
SOLICITATION NOTICE

A -- MPA2 Wafer Thinning, Dicing, Pick-and-Place, and Optional Die Tracing

Notice Date: 9/27/2023 6:26:27 AM
Notice Type: Solicitation
NAICS: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
Contracting Office: FERMILAB - DOE CONTRACTOR Batavia IL 60510 USA
ZIP Code: 60510
Solicitation Number: RFP348245
Response Due: 10/20/2023 11:00:00 AM
Archive Date: 11/04/2023
Point of Contact: Sharon Duchaj, Phone: 6308408693
E-Mail Address: sduchaj@fnal.gov
(sduchaj@fnal.gov)
Description: �MPA2 Wafer Thinning, Dicing, Pick-and-Place, and Optional Die Tracing -�
Web Link: SAM.gov Permalink
(https://sam.gov/opp/95e7afb766fa4a4bacc5e37bde31d787/view)
Place of Performance: Address: Batavia, IL 60510, USA; Zip Code: 60510; Country: USA
Record: SN06846683-F 20230929/230927230056 (samdaily.us)
Source: SAM.gov Link to This Notice
(may not be valid after Archive Date)

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