SOLICITATION NOTICE
66 -- Silicon on Insulator (SOI) Wafers
- Notice Date
- 8/23/2023 10:20:37 AM
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 333242
— Semiconductor Machinery Manufacturing
- Contracting Office
- DEPT OF COMMERCE NIST GAITHERSBURG MD 20899 USA
- ZIP Code
- 20899
- Solicitation Number
- 1333ND23QNB680475
- Response Due
- 8/24/2023 9:00:00 AM
- Archive Date
- 09/08/2023
- Point of Contact
- Joni L. Laster, Forest Crumpler
- E-Mail Address
-
joni.laster@nist.gov, forest.crumpler@nist.gov
(joni.laster@nist.gov, forest.crumpler@nist.gov)
- Small Business Set-Aside
- SBA Total Small Business Set-Aside (FAR 19.5)
- Description
- Amendment I: The purpose of this amendment is to address a technical question received regarding a requirement as follows:� Question:�Kindly advise�the thickness for device layer? The thickness requested is quite thick. Usually the maximum request is in the few hundreds micron range but the requested thickness was 20000 microns.� Answer:� There are no requirements for a thickness of 20,000 microns?� Please see the NIST Requreiments attachment.� It is a possiblility that the reader version that you are using has change the micro symbol to mm?� As part of its effort in Single Photon-Single Electron devices, The National Institute of Standards and Technology (NIST), requires silicon-on-insulator (SOI) wafers with varying device layer thicknesses, to aid in back-etching for back illumination mode of operation. Plese see attachements for complete details.�
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/39ce32de9afd487796a29dd5a0a75139/view)
- Place of Performance
- Address: Gaithersburg, MD 20899, USA
- Zip Code: 20899
- Country: USA
- Zip Code: 20899
- Record
- SN06804172-F 20230825/230823230101 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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