MODIFICATION
59 -- Circuit Card Assembly
- Notice Date
- 8/23/2023 7:01:26 AM
- Notice Type
- Solicitation
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- DLA LAND WARREN WARREN MI 48397 USA
- ZIP Code
- 48397
- Solicitation Number
- SPRDL1-23-R-0115
- Response Due
- 9/21/2023 1:00:00 PM
- Archive Date
- 10/06/2023
- Point of Contact
- Karen Blasky, Phone: 5864671163
- E-Mail Address
-
Karen.Blasky@dla.mil
(Karen.Blasky@dla.mil)
- Description
- SPRDL1-23-R-0115 is for Circuit Card Assemblies. Please note that�The Technical Data Package (TDP) is Source Controlled�to Contractor: BAE (CAGE:076M6) and�Benchmark (CAGE: 323N3).� Approved Sources must meet the requirements of the TDP.
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/a06e762c0ea54f91bb07853e5a7f3c4b/view)
- Record
- SN06802892-F 20230825/230823230052 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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