SAMDaily.us | MOD | 66 | Wafer bonder and lithography aligner system

SAMDAILY.US - ISSUE OF APRIL 01, 2023 SAM #7795
MODIFICATION

66 -- Wafer bonder and lithography aligner system

Notice Date: 3/30/2023 12:11:53 PM
Notice Type: Combined Synopsis/Solicitation
NAICS: 333242 — Semiconductor Machinery Manufacturing
Contracting Office: DEPT OF COMMERCE NIST GAITHERSBURG MD 20899 USA
ZIP Code: 20899
Solicitation Number: 1333ND23QNB680164
Response Due: 4/20/2023 8:59:00 PM
Archive Date: 05/05/2023
Point of Contact: Angela Hitt, Phone: 3034977305, Tracy Retterer
E-Mail Address: angela.hitt@nist.gov, Tracy.retterer@nist.gov
(angela.hitt@nist.gov, Tracy.retterer@nist.gov)
Small Business Set-Aside: SBA Total Small Business Set-Aside (FAR 19.5)
Description: See Combined Synopsis Solicitation and NIST Requirements for solicitation details.
Web Link: SAM.gov Permalink
(https://sam.gov/opp/07644b2d6083475ab2a21d09da49e3cc/view)
Place of Performance: Address: Gaithersburg, MD 20899, USA; Zip Code: 20899; Country: USA
Record: SN06634920-F 20230401/230330230107 (samdaily.us)
Source: SAM.gov Link to This Notice
(may not be valid after Archive Date)

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