SPECIAL NOTICE
99 -- New Approaches for Failure Analysis in 3D Heterogeneously Integrated Circuits RFI
- Notice Date
- 3/3/2023 12:07:59 PM
- Notice Type
- Special Notice
- Contracting Office
- DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA)
- ZIP Code
- 00000
- Solicitation Number
- DARPA-SN-23-50
- Response Due
- 4/5/2023 1:00:00 PM
- Point of Contact
- Dr. Anna Tauke-Pedretti
- E-Mail Address
-
DARPA-SN-23-50@darpa.mil
(DARPA-SN-23-50@darpa.mil)
- Description
- This Request for Information (RFI) from the Defense Advanced Research Projects Agency�s (DARPA) Microsystems Technology Office (MTO) seeks information on new techniques and approaches to localize faults and characterize defects in 3D heterogeneously integrated microsystems.� See attachment for full details.
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/1b9cba12c63c4467a9553eed1a5b5c25/view)
- Record
- SN06607863-F 20230305/230304211926 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
| FSG Index | This Issue's Index | Today's SAM Daily Index Page |