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SAMDAILY.US - ISSUE OF DECEMBER 08, 2022 SAM #7678
SPECIAL NOTICE

66 -- Dual function, HMDS vapor prime and image reversal oven for semiconductor photolithography

Notice Date
12/6/2022 2:26:46 PM
 
Notice Type
Special Notice
 
NAICS
334516 — Analytical Laboratory Instrument Manufacturing
 
Contracting Office
NASA SHARED SERVICES CENTER STENNIS SPACE CENTER MS 39529 USA
 
ZIP Code
39529
 
Solicitation Number
80NSSC23822950Q
 
Response Due
12/9/2022 2:00:00 PM
 
Point of Contact
Jessica Falls
 
E-Mail Address
jessica.d.falls@nasa.gov
(jessica.d.falls@nasa.gov)
 
Small Business Set-Aside
SBA Total Small Business Set-Aside (FAR 19.5)
 
Description
NASA Glenn Research Center at Lewis Field needs a dual function oven for photolithography processing of silicon carbide (SiC) integrated circuits (ICs) and sensors for aerospace applications. This oven should meet the following capabilities/specifications: 1. Clean room compatibility: ISO 4 2. Wafer size: 150 mm 3. Capacity: 2 cassettes of twenty-five (25) 100mm diameter wafers 4. Process gas/chemical inputs: Nitrogen purge, ammonia, HMDS (hexamethyldisilazane) 5. Operating temperature: ambient to 250deg.C 6. Power: Single phase AC 7. System dimensions: up to 30� x 30� x 30� (inches) 8. Documented use in Govt./academic/semiconductor R&D facilities
 
Web Link
SAM.gov Permalink
(https://sam.gov/opp/b8f45b0b20ee4414b4de6483140b70c5/view)
 
Place of Performance
Address: USA
Country: USA
 
Record
SN06535809-F 20221208/221206230054 (samdaily.us)
 
Source
SAM.gov Link to This Notice
(may not be valid after Archive Date)

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