SPECIAL NOTICE
99 -- TECHNOLOGY TRANSFER OPPORTUNITY: Packaging for SiC Sensors and Electronics (LEW-TOPS-127)
- Notice Date
- 1/11/2021 12:13:41 PM
- Notice Type
- Special Notice
- NAICS
- 927110
— Space Research and Technology
- Contracting Office
- NASA HEADQUARTERS WASHINGTON DC 20546 USA
- ZIP Code
- 20546
- Solicitation Number
- T2P-GRC-00082
- Response Due
- 1/7/2022 2:00:00 PM
- Archive Date
- 01/22/2022
- Point of Contact
- NASA�s Technology Transfer Program
- E-Mail Address
-
Agency-Patent-Licensing@mail.nasa.gov
(Agency-Patent-Licensing@mail.nasa.gov)
- Description
- NASA�s Technology Transfer Program solicits inquiries from companies interested in obtaining license rights to commercialize, manufacture and market the following technology. License rights may be issued on an exclusive or nonexclusive basis and may include specific fields of use. NASA provides no funding in conjunction with these potential licenses. THE TECHNOLOGY: Innovators at NASA's Glenn Research Center have developed a planar, modular package that protects electronics and sensors more effectively in high-temperature conditions than previously available methods. Lack of reliability at high temperatures, due to poor packaging, have discouraged the global application and large-scale commercialization of high-temperature electronics and sensors. Capable of preserving operations even in a 600�C environment, this innovation offers hermetic protection for silicon carbide (SiC)-based devices, such as dynamic pressure sensors, static pressure sensors, temperature sensors, acoustic impedance channels, and buried connecting wires. This patented technology is a game-changer for industries that need semiconductor-based sensors and electronics to function optimally in high-temperature, extreme-vibration, and corrosive environments - from jet engine combustion chambers to nuclear power plants, and from deep-well drilling to Venus missions. To express interest in this opportunity, please submit a license application through NASA�s Automated Technology Licensing Application System (ATLAS) by visiting https://technology.nasa.gov/patent/LEW-TOPS-127 If you have any questions, please e-mail NASA�s Technology Transfer Program at Agency-Patent-Licensing@mail.nasa.gov with the title of this Technology Transfer Opportunity as listed in this beta.SAM.gov notice and your preferred contact information. For more information about licensing other NASA-developed technologies, please visit the NASA Technology Transfer Portal at�https://technology.nasa.gov/ These responses are provided to members of NASA�s Technology Transfer Program for the purpose of promoting public awareness of NASA-developed technology products, and conducting preliminary market research to determine public interest in and potential for future licensing opportunities. No follow-on procurement is expected to result from responses to this Notice.
- Web Link
-
SAM.gov Permalink
(https://beta.sam.gov/opp/b205c0d1b68949e3a81077e75b95d5c7/view)
- Record
- SN05888906-F 20210113/210111230102 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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