SPECIAL NOTICE
99 -- TECHNOLOGY TRANSFER OPPORTUNITY: X-Ray Diffraction Method to Detect Defects in Cubic Semiconductor (100) Wafers (LAR-TOPS-158)
- Notice Date
- 10/3/2019
- Notice Type
- Special Notice
- NAICS
- 927110
— Space Research and Technology
- Contracting Office
- NASA/Goddard Space Flight Center, NASA Headquarters Acquisition Branch, Code 210.H, Greenbelt, Maryland, 20771, United States
- ZIP Code
- 20771
- Solicitation Number
- T2P-LaRC-00016
- Archive Date
- 10/17/2020
- Point of Contact
- Langley Research Center,
- E-Mail Address
-
LARC-DL-technologygateway@mail.nasa.gov
(LARC-DL-technologygateway@mail.nasa.gov)
- Small Business Set-Aside
- N/A
- Description
- NASA's Technology Transfer Program solicits inquiries from companies interested in obtaining license rights to commercialize, manufacture and market the following technology. License rights may be issued on an exclusive or nonexclusive basis and may include specific fields of use. NASA provides no funding in conjunction with these potential licenses. THE TECHNOLOGY : NASA Langley Research Center has developed a method of using x-ray diffraction (XRD) to detect defects in cubic semiconductor (100) wafers. The technology allows non-destructive evaluation of wafer quality in a simple, fast, inexpensive process that can be easily incorporated into an existing fab line. The invention adds value throughout the semiconductor industry but is especially relevant in high end, high speed electronics where wafer quality has a more significant effect on yields. This technology is a method of using x-ray diffraction (XRD) to evaluate the concentration of crystal structure defects, and thus the quality, of cubic (100)-oriented semiconductor wafers. Developed to enhance NASA's capabilities in fabricating chips for aeronautics applications, the method supplants existing methods that not only destroy the wafer in question, but can take as long as a day to determine the quality of a single wafer. The approach can be used with any commonly used semiconductor, including silicon, SiGe, GaAs and others, in a cubic (100) orientation, which covers at least 90% of commercial wafers. It can also be used to evaluate the quality of epi layers deposited on wafer substrates, and of ingots before they are sliced into wafers. Uses for these technologies exist in fiber-optic test and measurement applications. To express interest in this opportunity, please submit a license application through NASA's Automated Technology Licensing Application System (ATLAS) by visiting https://technology.nasa.gov/patent/LAR-TOPS-158 If you have any questions, please contact Langley Research Center at LARC-DL-technologygateway@mail.nasa.gov with the title of this Technology Transfer Opportunity as listed in this FBO notice and your preferred contact information. For more information about licensing other NASA-developed technologies, please visit the NASA Technology Transfer Portal at https://technology.nasa.gov/ These responses are provided to members of NASA's Technology Transfer Program for the purpose of promoting public awareness of NASA-developed technology products, and conducting preliminary market research to determine public interest in and potential for future licensing opportunities. No follow-on procurement is expected to result from responses to this Notice.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/notices/f0081bd79e6c3924aab54a63d56be197)
- Record
- SN05467240-W 20191005/191003230753-f0081bd79e6c3924aab54a63d56be197 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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