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FBO DAILY - FEDBIZOPPS ISSUE OF JULY 04, 2019 FBO #6432
SOURCES SOUGHT

66 -- manual wire bonder

Notice Date
7/2/2019
 
Notice Type
Synopsis
 
NAICS
333242 — Semiconductor Machinery Manufacturing
 
Contracting Office
100 Bureau Drive, Building 301 Room B130 Gaithersburg MD 20899-1410
 
ZIP Code
20899-1410
 
Solicitation Number
AMD-SS19-27
 
Response Due
7/8/2019
 
Point of Contact
Forest Crumpler, Contract Specialist, Phone 3019756753
 
E-Mail Address
forest.crumpler@nist.gov
 
Small Business Set-Aside
N/A
 
Description
A manual wire bonder is required to prepare chip-based samples for electrical testing. This wire bonder will be used with a variety of samples incorporating a wide range of materials. As a result, a manual wire bonder is needed that can perform wedge, ball, and ribbon bonding. NOTE: THIS NOTICE WAS NOT POSTED TO FEDBIZOPPS ON THE DATE INDICATED IN THE NOTICE ITSELF (02-JUL-2019); HOWEVER, IT DID APPEAR IN THE FEDBIZOPPS FTP FEED ON THIS DATE. PLEASE CONTACT 877-472-3779 or fbo.support@gsa.gov REGARDING THIS ISSUE.
 
Web Link
Link To Document
(https://www.fbo.gov/spg/DOC/NIST/AcAsD/AMD-SS19-27/listing.html)
 
Place of Performance
Address: 100 Bureau Drive Gaithersburg, MD
Zip Code: 20899
Country: US
 
Record
SN05358556-F 20190704/190702230019 (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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