SOURCES SOUGHT
58 -- Market Survey for Second Generation Forward Looking Infrared (SGF): Thermal imaging components
- Notice Date
- 2/6/2017
- Notice Type
- Sources Sought
- NAICS
- 334519
— Other Measuring and Controlling Device Manufacturing
- Contracting Office
- Department of the Army, Army Contracting Command, ACC - APG (W15P7T) Division B, 6001 COMBAT DRIVE, Aberdeen Proving Ground, Maryland, 21005-1846, United States
- ZIP Code
- 21005-1846
- Solicitation Number
- MARKET-SURVEY-6121-1
- Archive Date
- 2/25/2017
- Point of Contact
- Jon Starkell, Phone: 443-861-2962, Brad Holtzapple,
- E-Mail Address
-
jon.l.starkell.civ@mail.mil, dla.apgmr@dla.mil
(jon.l.starkell.civ@mail.mil, dla.apgmr@dla.mil)
- Small Business Set-Aside
- N/A
- Description
- The Army Contracting Command-Aberdeen Proving Ground (ACC-APG) intends to acquire spares and repair services for the thermal imaging components identified within this announcement. This is for a possible five year Indefinite Delivery Indefinite Quantity (IDIQ) contractual effort. The thermal imaging components consist of infrared optics, infrared detectors, and associated electronics. These components are utilized in the Abrams Thermal Receiver (TRU), the M1A2 Commander's Independent Thermal Viewer (CITV), the M2/M3A3 Improved Bradley Acquisition System (IBAS), the M2/M3A3 Commander's Independent Viewer (CIV), and the Long Range Advanced Scout Surveillance System (LRAS3) programs. They are also utilized in the Navy's Phalanx program. The purpose of this survey is to locate sources that have the capability to produce or repair military-grade thermal imaging components and provide spares and repair data for tracking and management of spare and repair actions. This survey is published in compliance with Federal Acquisition Regulation (FAR) Part 10, (Market Research). Past history for this spares and repair services indicates the only known sources with the capability to repair the spare parts of the thermal imaging components were Raytheon Network Centric Systems (McKinney, Texas) and DRS Technologies (Arlington, Virginia). Our current market research efforts further indicate that the Government owns limited data rights to the required components in tables below but components could not be procured and/or repaired using this limited data since it is not a complete technical data package. It would require additional effort from the potential contractor. This request for capability information does not constitute a request for proposals. Submission of any information in response to this market survey is purely voluntary. The US Government assumes no financial responsibility for any costs incurred in responding or in any subsequent exchange of information. The spares and repair services are for any or all of the thermal imaging components identified below: Description NSN Common Power Supply 5998-01-530-1227 Interface and Graphics CCA 5998-01-530-1095 TIS Power Supply 5998-01-530-1155 Motor Control CCA 5998-01-530-1438 EMI Filter 5915-01-534-2208 Table 1 Spares Table 2 Repairs Description NSN Common Power Supply 5998-01-530-1227 Imager 5855-01-464-1513 SADA IR Detector\Cooler Bench 5855-01-538-6686 Interface and Graphics CCA 5998-01-530-1095 Afocal 6650-01-538-5879 TIS Power Supply 5998-01-530-1155 Motor Control CCA 5998-01-530-1438 SADA IR Detector\Cooler Bench 5855-01-538-6085 EMI Filter 5915-01-534-2208 Answering this Market Survey The responses to this market survey will be used for informational purposes only. This is not a screening, information request or request for proposal of any kind. The US Government is not seeking or accepting unsolicited proposals. The Government will not pay for any information received or costs incurred in preparing the response to the market survey. Therefore any cost associated with the market survey submission is solely at the interested vendor's expense. The purpose of this market survey is to solicit statements of interest and capabilities from industry, including small businesses, service-disabled veteran-owned small businesses and 8(a) certified firms. Potential vendors should provide information, data or documentation, which show that they have previously produced or repaired thermal imaging components and/or military-grade thermal imaging equipment. For example, prior production and/or repair of thermal imaging components for US Government contract(s). Information received will be reviewed for form, fit and function. All proprietary and restricted information should be clearly marked. All responses to this market survey should be emailed to the Technical Point of Contact Jon Starkell, jon.l.starkell.civ@mail.mil, 443-861-2962 by 10 February 2017 at 5:00 PM EST. Technical questions regarding the requirements in this market survey may be sent to the Technical Point of Contact. Please include the announcement number in your e-mail.   MARKET SURVEY QUESTIONNAIRE Sources responding to this request for information should complete the following questions: If a question does not apply, please enter N/A or non-applicable. Additional information may be provided to support your technical capabilities of producing or repair and supplying repaired thermal imaging components and/or military-grade thermal imaging components with similar complexity and functionality of those assemblies/sub-assemblies used in the Second Generation Forward Looking Infrared Equipment (2GF). Describe your company's experience in inspection, repair and preparation for acceptance of equipment in accordance with internal processes used with assemblies similar in complexity and functionality of those used in the 2GF. 1) Describe your company's experience in updating a Technical Data Package. 2) Describe your company's experience in managing obsolescence issues. 3) Does your company maintain a Program and Assessment Tool to monitor and analyze the availability of components to allow clear and precise tracking of all obsolescence issues? If so, please elaborate on the Program and Assessment tool(s). 4) Describe your company's experience in identifying the alternatives for the unavailability of obsolete materials or components to mitigate obsolescence issues. 5) Describe your company's experience in re-designing an existing hardware component from a technical data package to meet specified Form, Fit and Function requirements. 6) Discuss your company's capability in meeting US Government contracting delivery order schedules. 7) Describe the level of expertise of your technicians (e.g. certification required and specific training) your technicians have. 8) Describe the methods/procedures used on the repair floor (i.e. lean methods) and what specific equipment do you use to repair systems of a similar technical nature as the 2GF. 9) Has your Company performed repair efforts in the past, if so provide Contract Number, Point of Contact (POC), e-mail address, phone number, and a brief description of your direct support of the effort?
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- SN04392530-W 20170208/170206235357-e23e70250acd07bbdab4ffa488a4d297 (fbodaily.com)
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