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FBO DAILY - FEDBIZOPPS ISSUE OF JANUARY 08, 2016 FBO #5159
SOURCES SOUGHT

A -- Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection - Request For Information (RFI)

Notice Date
1/6/2016
 
Notice Type
Sources Sought
 
NAICS
541712 — Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
 
Contracting Office
Department of the Air Force, Air Force Materiel Command, AFRL/RQK - WPAFB, AFRL/RQK, 2130 Eighth Street, Building 45, Wright-Patterson AFB, Ohio, 45433, United States
 
ZIP Code
45433
 
Solicitation Number
RFI-AFRL-RQKM-2016-0011
 
Archive Date
2/20/2016
 
Point of Contact
Dianna C. Aniton, Phone: (937) 713-9897, Dilip B. Punatar, Phone: (937) 255-4355
 
E-Mail Address
dianna.aniton@us.af.mil, dilip.punatar@us.af.mil
(dianna.aniton@us.af.mil, dilip.punatar@us.af.mil)
 
Small Business Set-Aside
N/A
 
Description
Request For Information (RFI) The Title III program has identified 3D High Density Microelectronics for Information Protection as a technology area of interest for its future activities, and interested firms are encouraged to determine if they have information pertaining to this topic. For the purpose of this RFI, the Government is defining 3D High Density Microelectronics for Information Protection as three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD and commercial supplier of 3D microelectronics modules incorporating Information Protection.
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/spg/USAF/AFMC/AFRLWRS/RFI-AFRL-RQKM-2016-0011/listing.html)
 
Record
SN03984317-W 20160108/160106234730-f2e7f25df9ee41def505308ba065d83b (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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