SOURCES SOUGHT
A -- Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection - Request For Information (RFI)
- Notice Date
- 1/6/2016
- Notice Type
- Sources Sought
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Department of the Air Force, Air Force Materiel Command, AFRL/RQK - WPAFB, AFRL/RQK, 2130 Eighth Street, Building 45, Wright-Patterson AFB, Ohio, 45433, United States
- ZIP Code
- 45433
- Solicitation Number
- RFI-AFRL-RQKM-2016-0011
- Archive Date
- 2/20/2016
- Point of Contact
- Dianna C. Aniton, Phone: (937) 713-9897, Dilip B. Punatar, Phone: (937) 255-4355
- E-Mail Address
-
dianna.aniton@us.af.mil, dilip.punatar@us.af.mil
(dianna.aniton@us.af.mil, dilip.punatar@us.af.mil)
- Small Business Set-Aside
- N/A
- Description
- Request For Information (RFI) The Title III program has identified 3D High Density Microelectronics for Information Protection as a technology area of interest for its future activities, and interested firms are encouraged to determine if they have information pertaining to this topic. For the purpose of this RFI, the Government is defining 3D High Density Microelectronics for Information Protection as three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD and commercial supplier of 3D microelectronics modules incorporating Information Protection.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/USAF/AFMC/AFRLWRS/RFI-AFRL-RQKM-2016-0011/listing.html)
- Record
- SN03984317-W 20160108/160106234730-f2e7f25df9ee41def505308ba065d83b (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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