SOLICITATION NOTICE
66 -- Atomic Layer Deposition System
- Notice Date
- 8/20/2012
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 333295
— Semiconductor Machinery Manufacturing
- Contracting Office
- ACC-APG - Adelphi, ATTN: AMSRD-ACC, 2800 Powder Mill Road, Adelphi, MD 20783-1197
- ZIP Code
- 20783-1197
- Solicitation Number
- W911QX12R0046
- Response Due
- 9/20/2012
- Archive Date
- 11/19/2012
- Point of Contact
- Tammy L. Wright, 301-394-0045
- E-Mail Address
-
ACC-APG - Adelphi
(tammy.l.wright1@us.army.mil)
- Small Business Set-Aside
- Total Small Business
- Description
- (i) This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued. (ii) The solicitation number is W911QX-12-R-0046. This acquisition is issued as an request for quotation (RFQ). (iii) The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular 2005-60. (iv) This acquisition is set-aside for small business concerns. The associated NAICS code is 333295, SIC Code is 3559. The small business size standard is 500 employees. (v) The following is a list of contract line item number(s) and items, quantities and units of measure, (including option(s), if applicable): CLIN 0001 - Quantity: One (1), Unit of Issue: EA, Description: Atomic Layer Deposition System, shipping, and training according to salient characteristics. OPTION CLIN 0002 - Quantity; One (1), Unit of Issue: EA, Description: Remote Plasma Source OPTION CLIN 0003- Quantity; Five (5), Unit of Issue: EA, Description: precursor manifold and valve packages OPTION CLIN 0004 - Quantity; One (1), Unit of Issue: EA, Description: Reactant Gas inputs OPTION CLIN 0005 - Quantity; One (1), Unit of Issue: EA, Description: Reactant Gas MFC including positive shut-off valve compatible with the deposition of ALD materials listed as part of section C.3.2 OPTION CLIN 0006- Quantity; One (1), Unit of Issue: EA, Description: Reactant Gas MFC including positive shut-off valve compatible with the deposition of ALD materials listed as part of section C.3.2 OPTION CLIN 0007 - Quantity; One (1), Unit of Issue: EA, Description: liquid/solid reactant input (high vapor pressure) precursor OPTION CLIN 0008 - Quantity; One (1), Unit of Issue: EA, Description: liquid/solid reactant input (low vapor pressure bubbler type) precursor OPTION CLIN 0009 - Quantity; One (1), Unit of Issue: EA, Description: Residual Gas Analyzer OPTION CLIN 0010 - Quantity; One (1), Unit of Issue: EA, Description: Spare Parts (vi) Description of requirements: C.1 Atomic Layer Deposition System Requirement (CLIN 0001) The Contractor shall deliver and install at the Army Research Laboratory (ARL), Adelphi, MD a quantity of one (1) fully functional Atomic Layer Deposition (ALD) System that meets all requirements as stated below. C.1.1 The Contractor shall ensure that the ALD System processes substrates that meet the specifications listed in Table 1. Table1: Substrates to be processed Wafer Diameter(mm)- 100mm Thickness Range(um)- 200um-1000um Configuration - Semiconductor Equipment and Materials International (SEMI) standard flats Materials - Silicon, Glass, Gallium Arsenide, Sapphire, Silicon Carbide Wafer Diameter (mm) - 150mm Thickness Range (um) - 200um-1000um Configuration - SEMI standard flats or notch Materials - Silicon, Glass, Gallium Arsenide, Sapphire, Silicon Carbide C.1.2 The Contractor shall ensure the ALD System is fully equipped and meets the minimum requirements as follows: -Is Class 100 compatibility in its entirety -Is capable of being operated in automatic mode, utilizing programmed process operations, semi-automatic mode, utilizing safety interlock features; or manual mode, allowing independent control of all operating components. -Is capable to meet current industry standard requirements for safety including the use of Emergency Off (EMO) panic buttons, shielding, interlocks for hazardous areas including high voltages and moving parts, and over temperature shutoffs should the heater malfunction. C.1.3The Contractor shall ensure that the ALD System includes a process chamber meeting the following specifications: -Stainless-steel chamber with front-side wafer loading port -Top-mounted vapor delivery system -A minimum of one (1) port for in-situ analysis (e.g., spectroscopic ellipsometer) -Temperature controlled reactant inputs -Substrate heater stage (with stainless-steel embedded heater element) capable of operation up to 500 degrees Celsius ( C) (approximately 400 C substrate temperature). -Temperature uniformity of the heater is +/- 3% at 500 C. -All electrical components are isolated from vacuum. -A pin lift mechanism enables substrate transfer. -Chamber heating to 150 C to mitigate and prevent unwanted film deposition on chamber walls -Uses a curtain gas or precursor focusing technology to limit film deposition on the chamber sidewalls to less than 5% of the deposition on the substrate surface. C.1.4 The Contractor shall ensure that the ALD System includes a Vacuum System meeting the following specifications: -Chemical resistant, oxygen (O2) compatible (Fomblinized) 42 cubic feet per minute (cfm), rotary vane pump for reactant chamber -Process pressure approximately1 Torr -Pressure measurement is accomplished with a single heated (150 C) Baratron Capacitance Manometer (10 Torr full-scale) C.1.5The Contractor shall ensure that the ALD System includes a Process Gas Distribution meeting the following specifications: -One (1) heated, bubbler type, low vapor pressure precursor delivery module for liquid/solids, including one (1) mass flow controller (MFC), three (3) high-speed ALD valves, and one (1) shut off valve -One (1) heated, high vapor pressure precursor delivery module for liquid/solids, including one (1) MFC, one (1) high-speed ALD valve, and one (1) shut-off valve -All delivery lines are heated to 200 C -All inputs come through a top-mounted, showerhead-type arrangement -One (1) curtain/purge gas input with one (1) MFC and one (1) shut-off valve -Two (2) purge gas inputs with two (2) MFCs, two (2) shut-off valves and six (6) metering valves for distribution C.1.6 The Contractor shall ensure that the ALD System includes Water Distribution Manifold meeting the following specifications: -Manual shut off valves -Interlocked flow switches to critical components -One inch (1") National Pipe Thread (NPT) connections (inlet and outlet) C.1.7 The Contractor shall ensure that the ALD System includes Power Distribution meeting the following minimum specifications: -Single service drop (208 volts alternating current (VAC), 60 Hertz (Hz), three (3) phase, five (5) wire, 60 Amperes (Amps) based on configuration) -Component wiring is routed to a centralized power distribution panel for each primary module -EMO protection -Appropriate safety interlocks C.1.8 The Contractor shall ensure that the ALD system includes a Load Lock With six (6) Wafer Cassette Loader meeting the following specifications: -Load lock connects directly to deposition chamber via a slit valve. -Aluminum construction with hinged top loading door (with viewport) -Direct interface to ALD -High vacuum slit valve between ALD System's processing chamber and load lock. -Dedicated 210 l/second turbo pump, isolation gate valve with appropriate dry roughing pump (vacuum level 5 x10-7 Torr or better - clean and dry) -Wide-range pressure gauging -A pin-lift mechanism enables substrate transfer -Substrates are manually loaded into the load lock and then transferred automatically to the ALD processing chamber and subsequently processed. -Substrates are automatically transferred from the load lock to the ALD processing chamber through recipe/software control using a linear rack and pinion transfer mechanism which is mounted directly to the load lock. Substrates can be manually transferred from the load lock to the ALD processing chamber for manual processing. -Automatic substrate or wafer transfer includes wafer retrieval and subsequent transfer and processing of up to six (6) wafers. C.1.9 The Contractor shall ensure that the ALD system contains Software & Computer Controls with the following features: -Screen layouts follow the guidelines of SEMI E95-0200 (specifications for Human interface for semiconductor manufacturing equipment) -PC provides supervisory computer control over vacuum pumping, vent, transfer and process. -Provides automatic recipe control capability -Provides automatic wafer handling and processing of up to six (6) wafers using appropriately configured load lock and cassette loader -Recipe tracer viewable on all screens -Programming/control is accomplished via a keyboard, mouse and touch screen -Three (3) levels of password protection -Includes Graphical User Interface (GUI) display of the following ALD System parameters: Vacuum: Process chamber and foreline pump, valve and gauge indicators/controls; curtain and purge gas indicators/controls; residual gas analyzer (RGA) pump, valve and gauge indicators/controls; load lock pump, valve and gauge indicators/controls Deposition: Source carrier and reactant gas indicators/controls; remote plasma indicators/controls; capman pressure trend plotter Heating: Substrate indicators/controls; chamber/foreline indicators/controls; source heating indicators/controls ALD Setup: ALD sequence; source and MFC setup Transfer: Motor indicators/controls; substrate pin-lift indicators/controls Operation Navigation: Maintenance screen; password level (accessed through recipe database); data log button; standard recipe buttons (i.e. pump, vent, transfer, heating) The ALD System can be run automatically or manually from the keyboard or touch screen -Software Process programming and history logging is accessible as readable text, comma separated variable, or Excel data file. -The Contractor shall provide all new software releases, upgrades and patches for the ALD System for three (3) years C.1.10. Reliability Specifications and Definitions: -Standard wafers - SEMI specification format in terms of geometry, with low to moderate wafer bow (less than 30 micrometers (um)), within the contracted materials and thickness range, minimal backside patterning, and no through wafer vias. -Fault: Something has gone wrong. -Failure: Equipment has a problem, requires repair. -Repair: Modification to hardware or software necessary for equipment to return to the standard operational specification as outlined in Section 2 and Section 3. -High Failure: Failure compromising personnel safety, equipment damage or product damage. -Low Failure: Failure not comprising personal safety, equipment damage or product damage. -Assist: Unplanned interruption, recoverable by operator reset without requiring repair. Post reset there is no variation from specified process behavior. -Uptime: Percentage of twelve (12) hour shift time that the equipment is able to process as specified. C.1.11The Contractor shall ensure the ALD system meets the following Metrics - Mean Time Before High Failure (MTBHF) No significant process variation from predetermined process set, processing standard and wafers. Greater than ninety (90) days (i.e. less than one (1) qualifying event per ninety (90) days). -Mean Time Before Low Failure (MTBLF) No significant process variation from predetermined process set, processing standard and wafers. Greater than thirty (30) days (i.e. less than three (3) qualifying event per ninety (90) days). -Mean Time Before Assist (MTBA Greater than five (5) days (i.e. less than 18 qualifying events per ninety (90) days). -Mean Time to Repair (MTTR) Time tool is not available for processing. Less than 72 hours -Uptime Higher than 95% C.1.12. Pre-installation Acceptance Tests The Contractor shall demonstrate to the Technical Point of Contact (TPOC) before shipment of the ALD system that the deposition in the system is fully functional at the Contractor's facility using the following Government created acceptance tests. The Contractor shall propose to the TPOC a date and time for acceptance test attendance at least one (1) month prior to proposed date. The TPOC will accept or deny the proposed date and time with three (3) days. C.1.12.1 The Contractor shall demonstrate that the deposition meets the required specifications as outlined in the Section C.1. 2, through C.1.9 which includes wafer handling, thermal processing temperatures, ramp rates, temperature uniformity, gas line configuration, and computer control. The Contractor shall provide all substrates and precursor materials for ALD System deposition demonstrations, unless otherwise noted in SectionC.1.12.2. C.1.12.2 The Contractor shall demonstrate that the ALD System is fully functional, which includes: Substrate handling queuing, and processing for at least 50 wafers (150 millimeters (mm) in diameter) -Pump in load lock, transfer to chamber, return to load lock, vent -Atmospheric pump down of load lock to facilitate chamber transfer in less than 10 minutes Configured with all appropriate gas/input lines -One (1) curtain/purge gas -Two (2) purge gas inputs -One (1) heated, bubbler type low vapor pressure precursor delivery module -One (1) heated, high vapor pressure precursor delivery module -All appropriate gas inputs pertaining to selected optional purchase items Substrate heating and rotation -Operating with a temperature range of operation of at least room temperature to 400 C at the substrate surface Deposition -Verify Aluminum Oxide (Al2O3) deposition Substrate - Silicon (Si) Deposition cycles less than 10 seconds (with less than 2% parasitic CVD components) Film thickness - 20 nanometers (nm) Cross-wafer uniformity on 150mm substrate less than 1% as measured by ellipsometry, reflectometry, or step height profilometry -Verify thick Al2O3 deposition Substrate - Silicon (Si) Deposition cycles less than 10 seconds (with less than 2% parasitic CVD components) Film thickness - 100 nm Cross-wafer uniformity on 150mm substrate less than 1% as measured by ellipsometry, reflectometry, or step height profilometry -Verify Platinimum (Pt) deposition Substrate - Si / Silicon Dioxide (SiO2) (500nm) / Titanium Dioxide (TiO2) (33 nm) to be provided as Government Furnished Material (GFM) Film thickness - 50 nm Cross-wafer uniformity on 150mm substrate less than 3% as measured by a sheet resistance measurement -Verify TiO2 deposition Substrate - Silicon (Si) Film thickness - 20 nm Cross-wafer uniformity on 150mm substrate less than 3% as measured by ellipsometry, reflectometry, or step height profilometry -Verify automated deposition of Al2O3 and wafer transfer Substrate - Si Film thickness - 20 nm Total wafer count - 12 (two (2) batches of six (6)) Cross-wafer uniformity on 150mm substrate less than 1% as measured by a ellipsometry, reflectometry, or step height profilometry Wafer-to-wafer uniformity on 150mm substrate less than 1% as measured by a ellipsometry, reflectometry, or step height profilometry -Verify multilayer coating process with Al2O3 and TiO2 precursor sources Substrate - Si Al2O3 layer thickness - 20nm TiO2 layer thickness - 10nm Total layers - 10 starting with Al2O3 coating Cross-wafer uniformity on 150mm substrate less than 3% as measured by a ellipsometry, reflectometry, or step height profilometry -Deposition uniformity Wafer-to-wafer uniformity (minimum of 10 wafers) using Al2O3 precursor source Wafer-to-wafer uniformity (minimum of 10 wafers) using TiO2 precursor source Wafer-to-wafer uniformity (minimum of 10 wafers) using Pt precursor source Average thickness uniformity on 150mm substrate less than 3% as measured by a ellipsometry, reflectometry, or step height profilometry C.2. Pre-installation Acceptance Tests Report The Contractor shall submit a pre-installation acceptance tests report to the TPOC outlining the results of the acceptance tests within one (1) week of the acceptance testing at the Contractor's site. The TPOC will review and approve the pre-installation acceptance tests report within one (1) week of receiving the pre-installation acceptance tests report. The Contractor shall ship the ALD System only after the TPOC has authorized the pre-installation acceptance tests report. C.3. Delivery and Installation The Contractor shall deliver and install the ALD System to ARL, 2800 Powder Mill Road, Building 207, Room 3B-41, within two (2) weeks of receiving approval of the pre-installation acceptance tests report from the TPOC. The Contractor shall propose a delivery date to the TPOC at least two (2) weeks prior to proposed date. The TPOC will approve or deny the proposed date and time within three (3) days. C.3.1. Post-installation Acceptance Tests The Contractor shall demonstrate to the TPOC the installed ALD System in room Building 207, Room 3B-41 at ARL is fully functional using the following Government-created post-installation acceptance tests: C.3.1.1 The Contractor shall demonstrate to the TPOC post-installation acceptance testing procedure for the ALD System to include wafer handling, thermal processing temperatures, ramp rates, temperature uniformity, gas line configuration, and computer control. The Contractor shall provide all precursor materials for ALD deposition demonstrations and the TPOC will provide all substrates as GFM. C.3.2 The Contractor shall demonstrate that the ALD System is fully functional, which includes: Substrate handling queuing, and processing for at least 50 wafers (150 millimeters (mm) in diameter) -Pump in load lock, transfer to chamber, return to load lock, vent -Atmospheric pump down of load lock to facilitate chamber transfer in less than 10 minutes Configured with all appropriate gas/input lines -One (1) curtain/purge gas -Two (2) purge gas inputs -One (1) heated, bubbler type, low vapor pressure precursor delivery module -One (1) heated, high vapor pressure precursor delivery module -All appropriate gas inputs pertaining to selected optional purchase items - Substrate heating and rotation -Operating with a temperature range of operation of at least room temperature to 400 C at the substrate surface Deposition -Verify Aluminum Oxide (Al2O3) deposition Substrate - Silicon (Si) Deposition cycles less than 10 seconds (with less than 2% parasitic CVD components) Film thickness - 20 nanometers (nm) Cross-wafer uniformity on 150mm substrate less than 1% as measured by ellipsometry, reflectometry, or step height profilometry -Verify thick Al2O3 deposition Substrate - Silicon (Si) Deposition cycles less than 10 seconds (with less than 2% parasitic CVD components) Film thickness - 100 nm Cross-wafer uniformity on 150mm substrate less than 1% as measured by ellipsometry, reflectometry, or step height profilometry -Verify Platinimum (Pt) deposition Substrate - Si / Silicon Dioxide (SiO2) (500nm) / Titanium Dioxide (TiO2) (33 nm) to be provided as Government Furnished Material (GFM) Film thickness - 50 nm Cross-wafer uniformity on 150mm substrate less than 3% as measured by a sheet resistance measurement -Verify TiO2 deposition Substrate - Silicon (Si) Film thickness - 20 nm Cross-wafer uniformity on 150mm substrate less than 3% as measured by ellipsometry, reflectometry, or step height profilometry -Verify automated deposition of Al2O3 and wafer transfer Substrate - Si Film thickness - 20 nm Total wafer count - 12 (two (2) batches of six (6)) Cross-wafer uniformity on 150mm substrate less than 1% as measured by a ellipsometry, reflectometry, or step height profilometry Wafer-to-wafer uniformity on 150mm substrate less than 1% as measured by a ellipsometry, reflectometry, or step height profilometry -Verify multilayer coating process with Al2O3 and TiO2 precursor sources Substrate - Si Al2O3 layer thickness - 20nm TiO2 layer thickness - 10nm Total layers - 10 starting with Al2O3 coating Cross-wafer uniformity on 150mm substrate less than 3% as measured by a ellipsometry, reflectometry, or step height profilometry -Deposition uniformity Wafer-to-wafer uniformity (minimum of 10 wafers) using Al2O3 precursor source Wafer-to-wafer uniformity (minimum of 10 wafers) using TiO2 precursor source Wafer-to-wafer uniformity (minimum of 10 wafers) using Pt precursor source Average thickness uniformity on 150mm substrate less than 3% as measured by a ellipsometry, reflectometry, or step height profilometry C.4. Post-installation Acceptance Tests Report The Contractor shall submit a post-installation acceptance tests report to the TPOC outlining the results of the acceptance tests within one (1) week after the completion of the post-installation acceptance testing. The TPOC will approve the post-installation acceptance tests report within one (1) week of receipt. C.5 Operator and Maintenance Training The Contractor shall conduct operator and maintenance training following the installation of ALD System at ARL. For training purposes, the Contractor shall travel to ARL in Adelphi, MD to provide one (1) day, a total of eight (8) hours, of the operator and maintenance training for up to eight (8) participants. The contractor shall ensure the training takes place within one (1) week after system installation and time approved by the TPOC in C.3. C.6. Troubleshooting and Warranty C.6.1 Troubleshooting The Contract shall provide access to a technical support person to answer questions regarding tool operation, hardware troubleshooting and basic ALD System deposition processing via telephone or email during normal business hours 0900-1700 for the time zone of the Contractor's main base of operation for the duration of ownership. The Contractor shall ensure the technical support person responds to voicemails and emails within two (2) business days. C.6.2 Warranty The Contractor shall provide a full warranty on the ALD System for one (1) year after approval of the post-installation test report. The Contractor shall ensure the warranty includes: -Installation and replacement of all parts (excluding consumable parts and materials) at no cost -All repairs or modifications if the ALD System is no longer functional according to the acceptance test specifications defined in C.1.12 at no cost -All labor and transportation costs to and from ARL for repairs and modification if the ALD System is no longer functional according to the acceptance test modifications defined in C.1.12. -A response time of 48 hours from the time the Government calls or emails in a request for service to diagnose and propose a plan to repair the ALD System, and commence repair activities within 96 hours from the time of request -Should the equipment fail to meet the specified reliability metrics during the first ninety (90) days of operation (the test period), the Contractor may elect to repair the system and start a new ninety (90) day test period. Should the system fail the reliability test three (3) times and not remain functional for a consecutive ninety (90) day period, the purchaser has the option to return the equipment for a full refund. C.7. Deliverables C.7.1 Pre-installation Acceptance Tests Report - The Contractor shall provide the TPOC with a Pre-installation acceptance tests report prior to shipment of the ALD System within eight (8) months after contract award. The TPOC will review and approve the pre-installation acceptance tests report within one (1) week of receiving the pre-installation acceptance tests report. The Contractor shall ensure the test report shows the test results for all test in C.1.12. The Contractor shall ensure the report is in electronic format. C.7.2 Post-installation Acceptance Tests Report - The Contractor shall provide the TPOC with a post-installation acceptance tests report after installation of the ALD System with acceptance with one (1) week after installation. The Contractor shall ensure test report shows the test results for all required tests in C.3.1. The Contractor shall ensure the report is in electronic format. C.7.3 ALD System - The Contractor shall deliver a fully functional ALD System that meets all the specifications in section C.1 to the location listed in C.3. C.7.4 ALD System Schematic Drawings/Operation Manual - The Contractor shall provide the TPOC upon delivery, with an electronic copy in Portable Document Format (.pdf) of the schematic drawings, including general assembly, vacuum, water, and electrical diagrams for the ALD System, along with an electronic copy of the Operation Manual for the ALD System written in English. C.7.5 Consumable Parts and Materials List - The Contractor shall provide the TPOC, upon delivery a comprehensive list of all consumable items needed to maintain the operation of a 24/7 fully functional ALD System, to include required quantity, part number, manufacturer, and ordering information. C.8. OPTIONAL Equipment considered for purchase during the duration of the contract C.8.1 One (1) Remote Plasma Source (OPTION CLIN 0002) -Attaches to ALD system to provide plasma enhanced atomic layer deposition (PE-ALD) capability -Compatible with gas delivery system outlined in section C.1.5 -Compatible with the deposition of ALD materials listed as part of section C.3.2 -Top-mounted 13.56 Megahertz (MHz) inductively coupled remote plasma source -Quartz plasma tube -Minimum 1 kilowatt (kW) power supply -Auto-matching network -Includes reactant gas input for plasma gas delivery to the ALD deposition chamber C.8.2 Five (5) precursor manifold and valve package (OPTION CLIN 0003) -Attaches to ALD system to expand the overall number of precursors available for deposition -Compatible with gas delivery system outlined in section C.1.5 -Compatible with the deposition of ALD materials listed as part of section C.3.2 C.8.3 One (1) Set of Reactant Gas inputs (OPTION CLIN 0004) Compatible with gas delivery system outlined in section C.1.5 Compatible with the deposition of ALD materials listed as part of section C.3.2 Two (2) high speed ALD valves Two (2) shut-off valves Two (2) MFCs C.8.4 One (1) Reactant Gas MFC, including positive shut-off valve (OPTION CLIN 0005) compatible with the deposition of ALD materials listed as part of section C.3.2 ) C.8.5 One (1) Reactant Gas MFC, including positive shut-off valve (OPTION CLIN 0006) compatible with the deposition of ALD materials listed as part of section C.3.2 C.8.6 One (1) liquid/solid reactant input (high vapor pressure) precursor (OPTION CLIN 0007) Compatible with gas delivery system outlined in section C.1.5 Compatible with the deposition of ALD materials listed as part of section C.3.2 One (1) high speed ALD valve One (1) shut-off valve One (1) MFC Heated delivery lines up to 200 C C.8.7 One (1) liquid/solid reactant input (low vapor pressure bubbler type) precursor (OPTION CLIN 0008) Compatible with gas delivery system outlined in section C.1.5 Compatible with the deposition of ALD materials listed as part of section C.3.2 Three (3) high speed ALD valves One (1) shut-off valve One (1) MFC Heated delivery lines up to 200 C C.8.8 One (1) Residual Gas Analyzer (OPTION CLIN 0009) Attaches to ALD system differentially pumped stand-alone system Includes control and analysis software with 300 atomic mass unit (AMU) sensitivity C.8.9 One (1) Spare Parts Kit (OPTION CLIN 0010) Includes high wear items (such as valves, o-rings, MFCs) typical for an ALD system operating in a 24/7 environment to maintain operation for one year, along with a list of all wearable items. (vii) Delivery is required by 1/1/2013. Delivery shall be made to United Sates Army Research Laboratory, Shipping And Receiving, 2800 Powder Mill Rd Blg 102, Adelphi MD 20783-1197, (301) 394-5757. Acceptance shall be performed at the Army Research Laboratory, 2800 Powder Mill Road, Adelphi, MD 20783. The FOB point is destination. (viii) The provision at 52.212-1, Instructions to Offerors - Commercial, applies to this acquisition. The following addenda have been attached to this provision: NONE. (ix) The provision at FAR 52.212-2, Evaluation - Commercial Items is applicable to this acquisition. The specific evaluation criteria to be included in paragraph (a) of that provision are as follows: The Government will award a contract resulting from this solicitation to the responsible offeror whose offer conforms to the solicitation and will be most advantageous to the Government, price and other factors considered. The following factors shall be used to evaluate offers: Technical, Past Performance and Price. The Technical element of the evaluation will be a determination as to whether the proposed product meets the performance characteristics and specifications in the solicitation. The Technical element of the evaluation shall be based solely on information furnished by the vendor. The Government is not responsible for locating or securing any information, which is not identified in the proposal. To ensure sufficient information is available, vendors must furnish as part of their proposal all descriptive material (such as cuts, illustrations, drawings, or other information) necessary for the Government to determine whether the product meets the performance characteristics and specifications of the requirement. If the offeror proposes to modify a product so as to conform to the requirement of this solicitation, the offeror shall include a clear description of such proposed modifications and clearly mark any descriptive materials to show modifications. Past performance will be evaluated based on information provided by the offeror as to actual sales of the proposed product to industry or Government agencies. Past performance will consider the ability of the offeror to meet technical specifications, delivery schedules (with warranty fulfillment and maintenance reputation included as applicable). Offerors shall include four (4) records of relevant sales for similar systems from the previous 12 months. Offerors shall identify a point of contact for each sale by providing a name and telephone number. Price will be evaluated based on the total proposed price, including options, (if any). Technical and past performance are of equal importance and when combined are significantly more important than price. The Government reserves the right to award to other than the lowest price and to award without discussions. (x) Offerors shall include a completed copy of the provision at FAR 52.212-3, Offeror Representations and Certifications - Commercial Items, and DFARS 252.212-7000, Offeror Representations and Certifications -Commercial Items, with its offer. (xi) The clause at 52.212-4, Contract Terms and Conditions - Commercial Items, applies to this acquisition. The following addenda have been attached to this clause: NONE. (xii) The clause at 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders - Commercial Items and DFARS 252.212-7001, Contract Terms and Conditions Required to Implement Statutes or Executive Orders Applicable to Defense Acquisitions of Commercial Items, applies to this acquisition. The following additional FAR/DFARS clauses cited in this clause are applicable: 52.203-3,52.203-6, 52.203-6 ALT I, 25.204-10, 52.209-6, 52.209-10, 52.219-6, 52.219-8, 52.219-14, 52.219-28, 52.222-3, 52.222-19, 52.222-21, 52.222-26, 52.222-35, 52.222-36, 52.222-37, 52.222-40, 52.223-18, 52.225-13, 52.232-33, 52.245-1, 252.203-7000, 252.211-7003, 252.211-7003 ALT I, 252.211-7007, 252.225-7001, 252.225-7012, 252. 252.232-7003, 252.243-7002, 252.247-7023. The full text of a clause may be accessed electronically at this/these address(es): http://farsite.hill.af.mil/ and https://www.acquisition.gov/Far/. (xiii) The following additional contract requirement(s) or terms and conditions apply: ACC-APG-ADL-B.5152.204-4409, ACC-APG-ADL-B.5152.204-4411, ACC-APG-ADL-B.5152.216-4407, ACC-APG-ADL-E.5152.246-4400, ACC-APG-ADL-G.5152.232-4418, ACC-APG-ADL-H.5152.205-4401, ACC-APG-ADL-H.5152.211-4401, ACC-APG-ADL-L.5152.203-40, ACC-APG-ADL-L.5152.215-41. A copy of the full text of these provisions will be made available upon request. (xiv) This acquisition is rated under the Defense Priorities and Allocations System (DPAS) as: NONE. (xv) The following notes apply to this announcement: This action is 100 percent set-aside for small business concerns. (xvi) Offers are due on 09/20/2012, by 11:59 PM, at 2800 Powder Mill Road, Bldg 601, Adelphi, MD 20783 or via email to tracie.n.hardy.civ@mail.mil. (xvii) For information regarding this solicitation, please contact Tracie Hardy, 301-394-1203, tracie.n.hardy.civ@mail.mil.
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