MODIFICATION
66 -- Probe Cards
- Notice Date
- 8/16/2012
- Notice Type
- Modification/Amendment
- NAICS
- 334515
— Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, Maryland, 20899-1640, United States
- ZIP Code
- 20899-1640
- Solicitation Number
- SB1341-12-RP-0100
- Archive Date
- 9/7/2012
- Point of Contact
- Todd D Hill, Phone: 301-975-8802
- E-Mail Address
-
todd.hill@nist.gov
(todd.hill@nist.gov)
- Small Business Set-Aside
- Total Small Business
- Description
- The purpose of this amendment is to respond to questions from industry. As a result, the RFP is amended as follows: 1. The RFP requires a 4 um tip diameter. Is there any flexibility for the Government to accept a larger tip diameter? The specification for probe tip radius is for the sharpness of the tip in the case that the tip is sharpened at the very end. For probes with flat tip, the diameter can be as large as 8 microns in diameter. 2. Do you have a specification for planarity? The Government does not specify planarity and the offerors may propose based on their design as long as all other specifications are met. 3. Do you have a specification for overdrive? 50 um overdrive is acceptable. The key concern is the size of the scrub mark at maximum overdrive. It shall be kept below 15 um. 4. Do you have a specification for alignment? +/- 6 um maximum for alignment is acceptable. 5. Do you have a specification for contact force? Contact force is dependent upon the tip size. Since the contact pad material does vary from soft (Aluminum) to hard (TiN), the contact force must strike a balance. 6. Do you have a specification for tip depth? Tip depth is not critical for the Government - the offeror may propose based on their design as long as all other specifications are met. 7. Will a stiffener be required? Do you want to provide some threaded holes in the heat sink so that we can screw the ring to the heat sink and take the PCB out of the mechanical equation? The offeror may propose based on their design as long as all other specifications are met and it is up to the offeror to decide if a stiffener is needed or not to hold the probes in precise position at 200C (not wafer temperature, which may be significantly higher). If threaded holes are needed in the heat sink, it is possible as long as it is not conflicting with topside optical alignment using microscope. 8. Would the Government accept other than 1 pA per volt? This is a critical specification. 1 pA per volt is preferred, but the Government would accept 10 pA per volt as the maximum. 9. Can you give us some information about the bond pads: Al Thickness and pad type: Low-K; POA; BPOP? The system is designed for a wide range of reliability studies. Thus the bond pad will vary widely. 10. Can you send more mechanical information about how the card will be mounted to the prober? The probe card is mounted onto the Aluminum heat sink by the screw holes as shown on the drawing. The aluminum heat sink is a solid slap (1/2" thick) that is shaped similar to the probe card (with accommodation of mounting and the connecters). This aluminum slap is mounted on an Aluminum post (with thermal grease to ensure good thermal conduction to the post) that is connected to a water-cooled base plate.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DOC/NIST/AcAsD/SB1341-12-RP-0100/listing.html)
- Place of Performance
- Address: NIST, Gaithersburg, Maryland, 20899, United States
- Zip Code: 20899
- Zip Code: 20899
- Record
- SN02843849-W 20120818/120817001658-f991b451b362f2a9aec0d04f6515f150 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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