SOLICITATION NOTICE
A -- Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals) - DARPA-BAA-12-50 document
- Notice Date
- 6/7/2012
- Notice Type
- Presolicitation
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, Virginia, 22203-1714
- ZIP Code
- 22203-1714
- Solicitation Number
- DARPA-BAA-12-50
- Archive Date
- 2/28/2013
- Point of Contact
- Dr. Avram Bar-Cohen,
- E-Mail Address
-
DARPA-BAA-12-50@darpa.mil
(DARPA-BAA-12-50@darpa.mil)
- Small Business Set-Aside
- N/A
- Description
- Attachment 1: Approved Proposer Checklist DARPA-BAA-12-50 document The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniques needed to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks. See the full DARPA-BAA-12-50 document attached.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DARPA/CMO/DARPA-BAA-12-50/listing.html)
- Record
- SN02769431-W 20120609/120607235837-742c0a444f1acdcbb9b0dbb60387ad79 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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