AWARD
A -- Low Cost Thermal Imager Manufacturing
- Notice Date
- 9/26/2011
- Notice Type
- Award Notice
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, Virginia, 22203-1714
- ZIP Code
- 22203-1714
- Solicitation Number
- DARPA-BAA-11-27
- Archive Date
- 10/8/2011
- Point of Contact
- Jimmy K. Hupalar, Phone: 5712184810
- E-Mail Address
-
Jimmy.hupalar@darpa.mil
(Jimmy.hupalar@darpa.mil)
- Small Business Set-Aside
- N/A
- Award Number
- HR0011-11-C-0126
- Award Date
- 9/23/2011
- Awardee
- BAE Systems Information and Electronic Systems, 2000 N 15TH ST<br />, Arlington, Virginia 22201-2683, United States
- Award Amount
- $13,773,910
- Description
- Develop a wafer-scale integrated thermal imager manufacturing capability to produce very low cost and high throughput thermal camera components which can be used in a variety of applications such as clip-on thermal imagers, 360 Situational Awareness combat vehicles, thermal weapon sight. Facilitate technology transition of a very compact fully integrated thermal camera interfaced to a small handheld platform (ex. Cell phone).
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DARPA/CMO/Awards/HR0011-11-C-0126.html)
- Record
- SN02592885-W 20110928/110926235844-8fbbf654cf3f48770db5231dca2bfb17 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
| FSG Index | This Issue's Index | Today's FBO Daily Index Page |