SOURCES SOUGHT
59 -- Semiconductor Device, Diode, HCI
- Notice Date
- 6/24/2011
- Notice Type
- Sources Sought
- NAICS
- 541990
— All Other Professional, Scientific, and Technical Services
- Contracting Office
- Department of the Air Force, Air Force Materiel Command, Hill AFB OO-ALC, OO-ALC/PKXB, 6038 Aspen Ave (Bldg 1289), Hill AFB, Utah, 84056
- ZIP Code
- 84056
- Solicitation Number
- FA825011SSICBM
- Archive Date
- 8/16/2011
- Point of Contact
- Steven D Jorgensen, Phone: 801-586-1225, Kevin Zimmerschied, Phone: 801-775-2024
- E-Mail Address
-
Steven.Jorgensen@hill.af.mil, kevin.zimmerschied@hill.af.mil
(Steven.Jorgensen@hill.af.mil, kevin.zimmerschied@hill.af.mil)
- Small Business Set-Aside
- N/A
- Description
- This request is an announcement for information/market research for planning purposes. The synopsis does not constitute a request for proposal, request for quote, invitation for bid, nor does its issuance in any way obligate the Government or restrict the Government as to its ultimate acquisition approach. This synopsis is to notify interested contractors that the Government intends to procure the following Hardness Critical Item (HCI) diode. Potential contractors should have in-depth knowledge of the requirements of testing semiconductor devices for HCI applications involving neutron and gamma radiation testing. The end application is the ICBM Minuteman III weapon system. The work involves meeting the requirements cited in a Selected Item Drawing (SID) which the government owns and which specifies initial part supply, testing/acceptance criteria, and part remarking requirements. Drawings and tech data are available upon request by interested parties. Contractors who believe they are a qualified source to meet the SID for an HCI Diode should contact the Government official listed in this synopsis. Responders may be asked for information regarding their qualifications, standards certifications, prior experience on related work, and neutron/gamma testing facilities. NSN: 5961-00-999-0490 Part Number: 89108822-01 Noun: Semiconductor Device System: LGM-30G Estimated Quantity: 150 Following are some details on the Selected Item Drawing requirements: The procurement would be for an HCI diode, but the final delivered items must meet the requirements of the SID (89108822-01). The SID details what parts the Contractor must begin with, how to test those parts to verify Hardness, documentation requirements, and requirements to re-label the original parts with serial numbers and the Government's part number (89108822-01). The original/starting parts are specified as one of several JANTXV type diodes (JANTXV1N3600, JANTXV1N4150, JANTXV1N4150-1), which must be procured by the Contractor from the Qualified Suppliers listed by DLA in QPL-19500 and must meet wafer lot or date code lot requirements. When the Contractor has acquired the initial parts, the Selected Item testing will determine if those parts will meet the Government requirements. Traceability requirements must be met throughout. Parameter Drift Screening (PDS) is required both pre- and post-burn-in on all parts. Random sampling will be conducted to choose parts for Radiation Effects Testing (RET) with sampling criteria dependent on whether wafer lot or date code lot parts are available. RET consists of gamma and neutron testing as specified in the SID and associated Engineering Change Order (ECO) documentation. Reporting of test results shall be certified by Government Engineering and HCI personnel to pass inspection. Once parts have passed acceptance tests, the Contractor will be requried to re-mark the initial parts with the Government part number (89108822-01), serial number determined by Contractor, etc. as specified in the SID.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/USAF/AFMC/OOALC/FA825011SSICBM/listing.html)
- Record
- SN02481979-W 20110626/110624234729-ee095e8e030efcf59c2bfd1170310a22 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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