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FBO DAILY ISSUE OF OCTOBER 10, 2010 FBO #3242
SOLICITATION NOTICE

66 -- PLASMA ETCHER SYSTEM

Notice Date
10/8/2010
 
Notice Type
Presolicitation
 
NAICS
332721 — Precision Turned Product Manufacturing
 
Contracting Office
AMCOM Contracting Center - Missile (AMCOM-CC), ATTN: AMSAM-AC, Building 5303, Martin Road, Redstone Arsenal, AL 35898-5280
 
ZIP Code
35898-5280
 
Solicitation Number
W31P4Q-11-T-0004
 
Response Due
10/27/2010
 
Archive Date
12/26/2010
 
Point of Contact
Sarah Hackney, 256-842-7260
 
E-Mail Address
AMCOM Contracting Center - Missile (AMCOM-CC)
(sarah.hackney@us.army.mil)
 
Small Business Set-Aside
N/A
 
Description
The Government intends to procure one commercially available Plasma Etcher System (Phantom III RIE Etch System) from Trion Technology, Inc., Clearwater, FL. This requirement shall consist of the following components: The capability to etch wafer type substrates using state of the art inductively coupled plasma (ICP) techniques. This system shall have the capability to etch silicon and other inorganic and organic substances commonly used in a micro-fabrication laboratory where typically, but not exclusively, microelectromechanical (MEMS) devices are fabricated from silicon and related materials. Automatic gas pressure control for the regulation of gasses supplied to the etching chamber. The platen for the system shall accommodate 200 mm diameter substrates. A heater/chiller capability for substrate temperature control. The substrate holding mechanism shall be of a mechanical clamping type. The top platen power shall be at least 1200 Watts input power. The system shall have a recirculation type cooling system to maintain operating temperatures of critical components of the system. The system shall have a load lock for faster pump down time after a change of substrate. The system shall have a laser based endpoint detection for the measurement of the etch depth of the substrate. The system shall be capable of automatic tuning of the RF coupling network to achieve maximum power input with minimum reflected power. The system shall use turbo vacuum pumps to achieve higher vacuum with scroll dry roughing pumps. There shall be a minimum of six gas mass flow controllers installed on the system for gas inputs. The system shall be controlled from a control computer with a MS-Windows with a touch screen graphical user interface. Control of all system operating functions shall be convenient to use. Installation of the system at the users facility and bring the system up and demonstrate all operational and specification performance levels. Operator and maintenance manuals for the system. The system shall be constructed of new materials. No used, reconditioned or refurbished parts shall be used. One (1) year warranty for parts and labor for maintenance for the system. This Plasma Etcher System will be used in the fabrication of micro/nano-electrochemical systems (MEMS/NEMS) sensor devices and for microcircuit die material validation, verification, and failure analysis in support of Weapons Sciences Directorate (WSD), AMRDEC. Trion Technology, Inc. has over 25 years experience in the fabrication of etching systems for micro-fabrication laboratories and is the only known source for this requirement. This laboratory instrument is desired to be directly compatible with program partner existing capability (instrument) and it is desired for WSD to duplicate their laboratory instrument to facilitate the portability of fabrication processes already researched. Any other instrument would incur increased program costs to the Government. Plasma etchers acquired from another vendor (brand) would have differences in etch chemistries and hardware that would produce varying results when compared to existing processes. All responsible sources may submit a quotation which shall be fully considered by the agency under a low price technically acceptable source selection process meeting or exceeding the minimum system requirements. Point of contact is Sarah Hackney, Contract Specialist, telephone 256-842-7260, e-mail sarah.hackney@us.army.mil.
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/notices/8b238691f4ed57ef1e1d27b3c9dc1b8c)
 
Place of Performance
Address: Weapon Science Directorate RDMR-WSI Redstone Arsenal AL
Zip Code: 35898
 
Record
SN02308721-W 20101010/101008233909-8b238691f4ed57ef1e1d27b3c9dc1b8c (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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