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FBO DAILY ISSUE OF MAY 15, 2010 FBO #3094
SOURCES SOUGHT

B -- Mitigating Restriction of Hazardous Substances (RoHS) Lead-free Issues in Aerospace Circuit Board Manufacturing

Notice Date
5/13/2010
 
Notice Type
Sources Sought
 
NAICS
541330 — Engineering Services
 
Contracting Office
Department of the Air Force, Air Force Materiel Command, Hill AFB OO-ALC, OO-ALC/PKXB, 6038 Aspen Ave (Bldg 1289), Hill AFB, Utah, 84056
 
ZIP Code
84056
 
Solicitation Number
OOALCEN
 
Point of Contact
Gary Dowdy, Phone: 801-586-1865
 
E-Mail Address
gary.dowdy@hill.af.mil
(gary.dowdy@hill.af.mil)
 
Small Business Set-Aside
N/A
 
Description
The Government is performing market research on potential sources for the following aerospace requirements. NAICS Subsectors may be 541330, or 2007 NAICS code 541380. This notification is for market research purposes to identify potential contractors who have the skills, experience, and knowledge required to successfully complete this effort for Hill Air Force Base, Utah and does not constitute a commitment, implied or otherwise, that a procurement will be accomplished. This is not a request for proposal or invitation for bid. To be considered as a potential source for this requirement, a Contractor will be required to submit technical data, in response to a solicitation, verifying their capabilities for engineering analysis. The Contractor will be required to verify capabilities to identify problematic manufacturing process areas, plan, execute, and report results of circuit board reliability studies related to aerospace applications to determine suitability of lead-free technologies replacement for established performance of tin-lead (typically 63Sn37Pb) technologies and develop quality measures suitable for military or aerospace repair and manufacturing. Request information on approach, scope, and duration of analysis for identifying and mitigating lead-free manufacturing processes. Request information such as rough order of magnitude (ROM) cost on non-recurring engineering service charges. Respondents to this request will be retained in a file and subsequently notified when Request for Proposal/Quote (RFP/Q) is posted in Federal Business Opportunities (FedBizOpps). Responding to this request in no manner guarantees a contract will be awarded to the respondent for the potential sources market research. Replies from interested engineering services sources must be received by June 18, 2010. Please notify this office of your interest by sending your contact information to Gary Dowdy, Engineer, AFMC/OO-ALC/ENSN via e-mail to gary.dowdy@hill.af.mil or fax at 801-586-1865. Technical Aspects: 1. Identify potential problem areas and/or identify processes that best control accidental usage of lead-free technology in a military depot repair and manufacturing environment. 2. Identify potential problem areas and/or identify processes that intentionally use lead-free technology and best provide equivalent performance of tin-lead technology in a military depot repair and manufacturing environment. 3. Mitigation from Tin Whisker formations 4. Circuit boards can be: a. surface mount, through hole, or mixed b. lead-free components mixed with tin-lead components c. Tin-lead technology with few lead-free finishes on component legs d. Lead-free finishes on bare circuit cards using tin-lead solder 5. Temperature -54° C to +71° C 6. Shock a. Test according to MIL-STD-810F or equivalent b. Effective Shock/Transient Duration (Td), msec 40 +/- 7% 7. Vibration a. Test according to MIL-STD-810F or equivalent b. Random Non-Buffet Vibration 20 - 2000 Hz c. Buffet Vibration 20 - 100 Hz 8. Humidity a. Operational Level 95% at 86°F b. Test according to MIL-STD-810F or equivalent 9. Altitude -300 to 55000 ft
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/spg/USAF/AFMC/OOALC/OOALCEN/listing.html)
 
Place of Performance
Address: TBD, United States
 
Record
SN02149162-W 20100515/100513235510-d1d5c5936f9e0bd3063dddd9c1358f99 (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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