SOURCES SOUGHT
66 -- RECOVERY - HIGH RATE SILICON DEEP REACTIVE ION ETCHER
- Notice Date
- 12/28/2009
- Notice Type
- Sources Sought
- NAICS
- 334516
— Analytical Laboratory Instrument Manufacturing
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, Maryland, 20899-1640
- ZIP Code
- 20899-1640
- Solicitation Number
- AMD-10-SS29
- Archive Date
- 1/28/2010
- Point of Contact
- Eduardo F. Baca, Phone: 3019756388, Patrick K Staines, Phone: (301)975-6335
- E-Mail Address
-
eduardo.baca@nist.gov, patrick.staines@nist.gov
(eduardo.baca@nist.gov, patrick.staines@nist.gov)
- Small Business Set-Aside
- N/A
- Description
- RECOVERY - THIS IS NOT A REQUEST FOR QUOTATIONS; A FULLY DEVELOPED TECHNICAL AND PRICE QUOTATION IS NEITHER NECESSARY NOR DESIRED. INFORMATION RECEIVED WILL BE USED FOR MARKET RESEARCH PURPOSES ONLY. THIS CONTEMPLATED PROCUREMENT IS ANTICIPATED TO UTILIZE THE AMERICAN RECOVERY AND REINVESTMENT ACT (ARRA) OF 2009 FUNDING IF IT IS DETERMINED THAT RESPONSIBLE SOURCES CAN SATISFY THE REQUIREMENT. All responsible sources are encouraged to respond to this notice; however, sources that do not respond shall not be precluded from responding to any subsequent solicitation. The National Institute of Standards & Technology (NIST)seeks a silicon dioxide deep reactive ion etching system for use at NIST facilities in Boulder, Colorado. The tool must provide capability in both deep (high rate/high aspect ratio) and shallow (moderate rate, sidewall angle control) processes will be required. The etcher will be used for fabricating superconducting thin film integrated circuits and microelectromechanical (MEMS) devices for a wide variety of sensor, imaging, ion confinement and biomagnetic research projects it NIST. All responses should clearly specify that the vendor is potentially interested in providing a complete High Rate Silicon Deep Reactive Ion Etcher (HRSDRIE). Responses from responsible sources should clearly establish capability of the HRSDRIE and components. After results of this market research are obtained and analyzed and specifications are developed for an HRSDRIE that can meet NIST's minimum requirements, NIST may conduct a competitive procurement and subsequently award a Purchase Order. If at least two qualified small businesses are identified during this market research stage, then any competitive procurement that results would be conducted as a small business set-aside. NIST has a requirement for an HRSDRIE that meets or exceeds the following minimum requirements: Wafer size: capable of handling 3 and 4" wafers. Automated load lock with multiple wafers capability. Full computer control, continuous data logging and recipe development software. Wafer chuck system capable of cooling wafer to <50 C during etch with minimal edge exclusion. Laser endpoint detection system shall be included. All necessary pumps, chillers, etc. to be included. Dry pumps availability. Proven process recipes for: 1. Deep (up to 500 micrometers) quartz etch using Cr, Al, Ni or Si mask with >88° sidewall angle. High rate (0.5 µm/min), high aspect ratio. 2. Shallow (<1 micrometer) silicon dioxide with controlled 45° sidewall using photoresist mask. Endpoint on metal or silicon underlayer. Good selectivity. 3. Medium (<10 micrometers) silicon dioxide with >88° sidewalls using photoresist mask. Thin film etches must result in polymer free surfaces. Etch recipes are all </= +/- 3% uniformity across the wafer as well as run-to-run. Requested Information to be Included in Responses to this Notice: 1. Please indicate whether your company manufactures or is an authorized reseller/business partner for a HRSDRIE of any kind and, if so, please provide complete commercial specifications for the HRSDRIE that your company manufactures or sells, including the name of the company that manufactures, reconditions, or remanufactures the HRSDRIE, where it is manufactured, and detailed functional and performance specifications that the product meets. 2. If your organization is an original equipment manufacturer of HRSDRIE, then please provide the name of company(ies) that are authorized by your organization, as the OEM, to sell your organization's HRSDRIE, as well as their addresses, and a point of contact for the company (name, phone number, fax number and email address). 3. Describe optional items that are available for purchase for the HRSDRIE, such as consumables, spares, tools, additional components, ancillary equipment, software licenses, telephone support, etc. 4. Indicate whether modifications of the HRSDRIE manufactured or sold by your organization would be necessary to meet Government specifications listed in this notice and, if so, indicate whether those modifications would be considered minor modifications as described in the FAR Subpart 2.101 definition of commercial item. 5. Provide any other relevant information that is not listed above which the Government should consider in developing its minimum specifications and finalizing its market research. Responses to this notice shall be sent by email to Eduardo F. Baca, Support Contractor, at eduardo.baca@nist.gov, with cc: to Patrick Staines at Patrick.staines@nist.gov, so that it is received at that email address no later than the closing date. The responses should include responses to the 12 questions listed above. Contracting Office Address: 100 Bureau Drive, Gaithersburg, Maryland 20899-1640 Primary Point of Contact: Eduardo Baca Support Contractor Contract Specialist eduardo.baca@nist.gov Phone: 301-975-6388 Secondary Point of Contact: Patrick Staines, Contracting Officer patrick.staines@nist.gov Phone: 301-975-6335
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DOC/NIST/AcAsD/AMD-10-SS29/listing.html)
- Record
- SN02031792-W 20091230/091228233936-ada3fdd01cee26bf1a9107431c97a7df (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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