SOURCES SOUGHT
66 -- RECOVERY-PLASMA ETCHERS AND HIGH DENSITY PLASMA CVD TOOLS
- Notice Date
- 4/7/2009
- Notice Type
- Sources Sought
- NAICS
- 333295
— Semiconductor Machinery Manufacturing
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, Maryland, 20899-1640
- ZIP Code
- 20899-1640
- Solicitation Number
- AMD-09-SS38
- Archive Date
- 5/7/2009
- Point of Contact
- Todd D Hill, Phone: 301-975-8802
- E-Mail Address
-
todd.hill@nist.gov
- Small Business Set-Aside
- N/A
- Description
- The National Institute of Standards & Technology (NIST) seeks information on commercial vendors that are capable of providing a suite of three plasma processing tools. The tools will be installed in a clean room at NIST in Boulder, CO. and will be used for fabricating superconducting thin film integrated circuits and microelectromechanical (MEMS) devices for a wide variety of sensor, imaging, ion confinement and biomagnetic research projects. After results of this market research are obtained and analyzed and specifications are developed for a suite of tools that can meet NIST's minimum requirements, NIST may conduct a competitive procurement and subsequently award a Purchase Order. If at least two qualified small businesses are identified during this market research stage, then any competitive procurement that resulted would be conducted as a small business set-aside. This contemplated procurement is anticipated to utilize Recovery Act Funding if it is determined that responsible sources can satisfy the requirement. NIST has a need for a suite of three plasma processing tools, a reactive ion etcher using fluorine chemistry for etching metals including Niobium and Molybdenum, a reactive ion etcher using chlorine chemistry for etching Aluminum and III-IV compound semiconductors, and a High Density Plasma Chemical Vapor Deposition System for depositing high quality SiO2 The three systems must have common user interfaces, common connections to safety and fire suppression systems and to the extent possible, common connections for utilities such as power, cooling water and process gases. In the aggregate, tools must meet the following requirements: 1.Capable of processing 3 inch, 100 mm and 150 mm wafers. 2.Automated load lock 3.Full computer control and recipe development software. 4.Automatic wafer-by-wafer data logging which records all tool parameters and user-entered data. 5.Wafer chuck system capable of cooling wafer to <10 C during processing with minimal edge exclusion. 6.Alumina-lined chamber; ICP source providing a minimum power of 2 kW. Source and/or chamber heating system to maintain a minimum temperature of 70C. 7.Proven and documented (via SEM images for etches, index and etch rate data for depositions) recipes for: a.Etching of Nb with 90±5 sidewall angle, etch rate > 200nm/min, >1:1 selectivity to resist and >10:1 selectivity to SiO2, ±5% uniformity across the wafer. b.Etching of Al with 90±1 sidewall angle, etch rate >150nm/min, >2:1 selectivity to resist, ±5% uniformity across the wafer. c.Etching of Al2O3 with >80 sidewall angle, etch rate >50 nm/min, >0.4:1 selectivity to resist, ±5% uniformity across the wafer. d.Etching of GaAs up to 5 micrometers thick with 90±5 sidewall angle, >5:1 selectivity to SiO2; GaAs and AlGaAs etch rate within 5% of each other. e.Growth of SiO2 with a wafer temperature <100C, deposition rate >50nm/min. Resulting oxide must have a pinhole density of <1/cm2 for a 300 nm thick film, index of refraction 1.45<n<1.49, and an etch rate of <1500 nm/min in a 10:1 buffered HF etch at 20C. NIST is seeking responses from all responsible sources, including large, foreign, and small businesses. Small businesses are defined under the associated NAICS code for this effort, 333295, as those domestic sources having 500 employees or less. Please include your company’s size classification in any response to this notice. Companies that manufacture suitable plasma processing equipment are requested to email a detailed report describing their abilities to todd.hill@nist.gov no later than the response date for this sources sought notice. The report should include achievable specifications and any other information relevant to your product or capabilities. Also, the following information is requested to be provided as part of the response to this sources sought notice: 1. Name of the company that manufactures the system components for which specifications are provided. 2. Name of company(ies) that are authorized to sell the system components, their addresses, and a point of contact for the company (name, phone number, fax number and email address). 3. Indication of number of days, after receipt of order that is typical for delivery of such systems. 4. Indication of whether each instrument for which specifications are sent to todd.hill@nist.gov are currently on one or more GSA Federal Supply Schedule contracts and, if so, the GSA FSS contract number(s). 5. Any other relevant information that is not listed above which the Government should consider in developing its minimum specifications and finalizing its market research.
- Web Link
-
FedBizOpps Complete View
(https://www.fbo.gov/?s=opportunity&mode=form&id=8280cef996d1d359b6f73859514f68d2&tab=core&_cview=1)
- Place of Performance
- Address: NIST, Gaithersburg, Maryland, 20899, United States
- Zip Code: 20899
- Zip Code: 20899
- Record
- SN01787429-W 20090409/090407215840-8280cef996d1d359b6f73859514f68d2 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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