FILE | A | Chip-Scale Vacuum Micro Pumps (CSVMP) - Full DARPA-BAA-08-75 document

FBO DAILY ISSUE OF OCTOBER 18, 2008 FBO #2518
DOCUMENT

A -- Chip-Scale Vacuum Micro Pumps (CSVMP) - Full DARPA-BAA-08-75 document

Notice Date: 10/16/2008
Notice Type: Full DARPA-BAA-08-75 document
NAICS: 541712 — Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
Contracting Office: Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, Virginia, 22203-1714
ZIP Code: 22203-1714
Solicitation Number: DARPA-BAA-08-75
Archive Date: 10/30/2009
Point of Contact: Dennis L Polla,, Phone: xxxxxxxxxxxx
E-Mail Address: dennis.polla@darpa.mil
Small Business Set-Aside: N/A
Description:   DARPA is soliciting innovative research proposals in the area of Chip-Scale Vacuum Micropumps (CSVMP). Proposed research should investigate innovative approaches that enable revolutionary advances in science, fabrication technology, devices, or systems relevant to attaining vacuum conditions on a semiconductor chip. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice. New developments in MEMS technologies require the development of microdevices that can provide ultra-low pressures at the chip scale. For example, the performances of micro-resonators, miniature thermally-isolated bolometers, rf switches, and chip-scale ionization based mass detectors would all benefit from revolutionary low-pressure micro-pumps capable of attaining vacuums as low as one microtorr.  DARPA will post a consolidated Question and Answer response after November 24, 2008, before final full proposals are due. In order to receive a response to your question, submit your question by November 17, 2008 to the BAA08-75@darpa.mil. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a full proposal to this DARPA BAA, should be directed to BAA08-75@darpa.mil. Full DARPA-BAA-08-75 document is attached.
Web Link: FedBizOpps Complete View
(https://www.fbo.gov/?s=opportunity&mode=form&id=e77ed7bd0eb2842fa03b18ba96729db4&tab=core&_cview=1)
Document(s): Full DARPA-BAA-08-75 document; File Name: Full DARPA-BAA-08-75 document (csvmp_darpa_baa_08_75_for_posting_16oct08.pdf); Link: https://www.fbo.gov//utils/view?id=059f70ab8950e1f8b4890f9e0ad5062a; Bytes: 489.06 Kb; Note: If links are broken, refer to Point of Contact above or contact the FBO Help Desk at 877-472-3779.
Record: SN01692598-W 20081018/081016214744-e77ed7bd0eb2842fa03b18ba96729db4 (fbodaily.com)
Source: FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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A -- Chip-Scale Vacuum Micro Pumps (CSVMP) - Full DARPA-BAA-08-75 document