SOLICITATION NOTICE
A -- High Frequency Integrated Vacuum Electronics (HiFIVE)
- Notice Date
- 7/9/2007
- Notice Type
- Solicitation Notice
- NAICS
- 541710
— Research and Development in the Physical, Engineering, and Life Sciences
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, VA, 22203-1714, UNITED STATES
- ZIP Code
- 00000
- Solicitation Number
- BAA07-49
- Response Due
- 10/23/2007
- Archive Date
- 7/9/2008
- Description
- DARPA is soliciting innovative research and development (R&D) proposals in the area of High Frequency Integrated Vacuum Electronics (HiFIVE) with the goal of demonstrating an integrated, microfabricated vacuum electronic (VE) high power amplifier (HPA) circuit for use in high-bandwidth, high-power transmitters. The proposer will exploit high precision microfabrication methods to construct a highly efficient VE interaction structure with the goal of achieving high-power (>50W) and high-bandwidth (>5GHz) amplification in the ?upper-millimeter-wave? spectral region, specifically at an operation frequency of 220GHz. As a key part of this effort, the proposer will develop an advanced cathode source and beam focusing approach leading to a 20keV electron beam characterized by very high transverse aspect-ratio and current density. The proposer must establish the ability to control the coupling and energy exchange inside the amplifier interaction structure without deleterious mode competition effects. Thermal management approaches will be developed to mitigate the extremely high heat loads which are expected to result from the inadvertent interception by the interaction structure of part of the electron beam. The proposer must also identify methods for effective recovery of spent beam energy leading to efficient operation of the VE device. To further improve HPA efficiency and reduce size, a first-stage driver circuit based on a solid-state monolithic microwave integrated circuit (MMIC) technology will be fabricated and incorporated into the overall HPA design. The program will culminate in an objective demonstration of a compact HPA in which the cathode, the electron-beam, the MMIC driver, the interaction structure, and the collection structure have been closely integrated into a compact assembly. Proposed HiFIVE R&D should investigate innovative approaches that enable revolutionary advances in science, materials, devices, and circuits. Specifically excluded is R&D that primarily results in incremental or evolutionary improvements to the existing state of practice DARPA Broad Agency Announcement (BAA) No. 07-49, entitled " High Frequency Integrated Vacuum Electronics (HiFIVE)," is provided as an attachment to this solicitation notice and includes information on the specific areas of interest; the submission process; abstract and proposal formats; evaluation and selection/funding processes; as well as all other pertinent administrative and contractual information. The BAA may be obtained from the FedBizOpps website: http://www.fedbizopps.gov/, World Wide Web (WWW) at URL http://www.darpa.mil/mto (go to "solicitation" area) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format or following the submission instructions described in the BAA may not be reviewed. Proposers Questions DARPA will use electronic mail for all technical and administrative correspondence regarding this BAA. Administrative, technical, or contractual questions should be sent via e-mail to BAA07-49@darpa.mil. If e-mail is not available; please fax questions to (703) 696-2206 (Attention: Dr. Mark Rosker). All requests must include the name, address, and phone number of a point of contact. Technical and contractual questions should include the originator's full name, email, and postal address in the text.
- Record
- SN01337572-W 20070711/070709221802 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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