SOLICITATION NOTICE
A -- RADIATION TOLERANT INTELLIGENT MEMORY STACK (RTIMS) MODULE DESIGN, MANUFACTURE AND ANALYSIS
- Notice Date
- 2/28/2005
- Notice Type
- Solicitation Notice
- NAICS
- 541710
— Research and Development in the Physical, Engineering, and Life Sciences
- Contracting Office
- NASA/Langley Research Center, Mail Stop 144, Industry Assistance Office, Hampton, VA 23681-0001
- ZIP Code
- 23681-0001
- Solicitation Number
- NNL05091778R
- Response Due
- 3/15/2005
- Archive Date
- 2/28/2006
- Description
- NASA/LaRC has a requirement for the manufacture and analysis of ten (10) additional Radiation Tolerant Intelligent Memory Stack (RTIMS) modules under existing NASA Contract NAS1-03064. The contract is for the design, manufacture, and analysis of the RTIMS. NASA Headquarters selected the RTIMS teamed project, resulting in NASA Contract NAS1-03064, in response to the NASA Office of Earth Science (OES), Advanced Information System Technology (AIST), NASA Research Announcement (NRA) 02-OES-04. The contract involves the design and development of the RTIMS physical hardware. The design, fabrication, testing, analysis, and demonstration of a reconfigurable radiation tolerant heterogeneous stacked memory array based on state-of-the-art chip stacking, radiation shielding and Field Programmable Gate Array (FPGA) technologies is required. After design verification and validation of the prototype RTIMS module, ten (10) RTIMS modules will be manufactured and delivered to NASA/LaRC with associated analyses and documentation. Since contract award, it has been determined that ten (10) additional RTIMS modules will be required to complete the environmental testing that is required to successfully meet the project?s goals. NASA/LaRC intends to issue a contract modification on a sole source basis to 3D Plus USA for the manufacture and analysis of ten (10) additional RTIMS modules as defined above. The statutory authority permitting other than full and open competition is 10 U.S.C. 2304(c)(1), as implemented by FAR 6.302-1, ?Only one responsible source?. 3D Plus USA was competitively selected as the partner on the RTIMS project, resulting in NASA Contract NAS1-03064, based on their extensive experience in designing and building proven mechanically rugged, radiation hardened, 3-dimensional interconnected, heterogeneous microelectronic modules for space application and its proprietary technology which enables the stacking of any kind of components in any available packaging. 3D Plus USA has played a key role, as a teaming partner, in the development of the RTIMS project and their unique skills are essential to the success of the project. The Government does not intend to acquire a commercial item using FAR Part 12. See Note 26. An Ombudsman has been appointed. See NASA Specific Note "B". Oral communications are not acceptable in response to this notice. All responsible sources may submit an offer, which shall be considered by the agency. See note 22. Any referenced notes may be viewed at the following URLs linked below. Any questions should be directed to Sharon D. DeBerry at (757) 864-7928 or by email: Sharon.D.Deberry@nasa.gov
- Web Link
-
Click here for the latest information about this notice
(http://prod.nais.nasa.gov/cgi-bin/eps/bizops.cgi?gr=D&pin=23#114411)
- Record
- SN00759845-W 20050302/050228212432 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
| FSG Index | This Issue's Index | Today's FBO Daily Index Page |