SOLICITATION NOTICE
A -- Ultra Thin Silicon on Saphire Semiconductor Process Development, Implementation and Demonstration
- Notice Date
- 11/2/2004
- Notice Type
- Solicitation Notice
- NAICS
- 541330
— Engineering Services
- Contracting Office
- Other Defense Agencies, Office of the Secretary of Defense, Defense Microelectronics Activity, Contracting Division 4234 54th Street, Building 620, McCellan, CA, 95652-1521
- ZIP Code
- 95652-1521
- Solicitation Number
- H94003-05-R-0001
- Response Due
- 11/22/2004
- Archive Date
- 12/7/2004
- Description
- This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6 as supplemented with additional information included in this notice. This announcement constitutes the solicitation. The NAICS code is 541330 and the size standard for this requirement is $4M. Solicitation number is H94003-05-R-0001 and is sole source to Peregrine Semiconductor of San Diego, CA. Title: 0.25m Ultra-thin Silicon-on-Saphire Semiconductor Process (UTSi) Development, Implementation and Demonstration. The objective of this SOW is to develop, implement, and demonstrate a 0.25m radiation hardened UTSi manufacturing process for use within the Defense Microelectronics Activity (DMEA) ARMs Foundry. The 0.25m UTSi process development will provide a cost effective solution for the DMEA design and fabrication capability required for the manufacturing of military and space qualified radiation hardened integrated circuits used to support the DMEA mission. This project is one part of a major research and development program at DMEA which incorporates many interrelated and interdependent projects. Reference Documents: Peregrine- DMEA Agreement Version 1 ? 02 Sep 04 Manufacturing & Technology Transfer Agreement The contractor shall develop, implement, and demonstrate the functionality of the DMEA ARMs Foundry for the 0.25m UTSi process. The contractor shall deliver process licenses, 0.25m UTSi design, simulation, and layout libraries, full flow and partial mask sets, and fabricated wafers. The contractor shall develop and deliver the items required to transfer the 0.25m UTSi process to the DMEA ARMs Foundry, including but not limited to,: - Improvement Process Description - UTSi? Spice Files for 0.25m technology - UTSi? Process Description for 0.25m technology - UTSi? Process Control Monitor Description for 0.25m technology - UTSi? Design Rules for 0.25m technology - UTSi? Process Simulations for 0.25m technology - All CAD/CAE design, simulation, cell, and layout libraries developed for the for 0.25m UTSi process The contractor shall transfer the 0.25m UTSi process to the DMEA ARMs Foundry. The contractor shall provide engineering and technical support during development efforts. The contractor shall provide the CAD/CAE standard cell library for circuit design, physical layout and design and layout verification and validation of circuits designed and fabricated at DMEA using the UTSi process. The contractor shall evaluate the DMEA ARMs Foundry equipment, manpower, and facility. Based upon the results of the evaluation, the contractor shall recommend the enhancements required to implement the 0.25m UTSi process delivered under paragraph 3.1 of this SOW. These recommendations shall be in the areas of equipment, manpower, chemicals and gasses, facility space, safety, environmental, costs, and any other that the contractor deems relevant. The contractor shall ensure the recommendations made comply with county, state, and federal codes. The contractor shall deliver a report that includes a preliminary drawing and schedule at a technical interchange meeting for government review and approval. (DI-MISC-80508) Option 1: Facility Augmentation: After the government approval, the contractor shall implement the recommendations made in the transfer study under paragraph 3.2.1. Design Library Validation: The contractor shall fabricate two (2) DMEA provided ASIC designs. The designs will be done using the libraries delivered under paragraph 3.2. DMEA will provide the designs for fabrication to the contractor in GDSII format. UTSi Wafer Manufacturing: The contractor shall perform wafer fabrications to support DMEA development efforts at the contractor?s facility as required in individual tasks. The contractor shall perform the fabrication efforts using government provided GDSII tapes or mask sets. The number of contractor fabrications shall not exceed six (6). Multi-project Run (MPR) Tile Manufacturing: The contractor shall perform partial wafer manufacturing on a MPR Tile at the contractor?s facility as required in individual tasks. The contractor shall perform the fabrication efforts using government provided GDSII tapes. The number of MPR fabrications shall not exceed 24 tiles. Engineering Services: The contractor shall provide process and design engineering services that target the UTSi process that are not covered under paragraphs 3.1 thru 3.4 of this SOW. The engineering services required shall be identified as individual tasks. The contractor shall participate in design consultation meetings as required in individual tasks. The total number of process and design engineering hours over the life of the contract shall not exceed 3,000. Period of performance is five (5) years from date of award. Technical Interchange Meetings (TIMs): The contractor shall participate in TIMs as required in individual orders. The contractor shall document the efforts, results, effectiveness, and progress of the actions taken to satisfy the requirements of this SOW in status and technical reports. The contractor shall administratively reserve sufficient funds to cover the preparation cost of the final technical report. Inspection and acceptance of all reports/data will be by the DMEA project engineer. Quarterly Status Reports: The contractor shall report financial data, efforts made, significant events, accomplishments, issues, and anticipated problems that may affect the planned efforts for the next quarter. The contractor shall summarize the progress of the all efforts required by this SOW and any anticipated changes in the commitments of personnel and equipment. (DI-MGMT-80368) Final Technical Report: The contractor shall prepare this report. The contractor shall provide a concise discussion of the significant accomplishments and progress for each of the requirements identified in this SOW. The final quarterly report may be included with the final report submission. (DI-MISC-80508) U.S. Citizenship is preferred for all personnel on this task. Certain aspects of the work on this requirement may necessitate SECRET clearance of some contract employees. Information acquired or generated on this Task Order is subject to the Privacy Act. For a complete formatted description, send an email request to hilton@dmea.osd.mil or fax your request to (916) 231-2826. Contractors must be registered in the Central Contractor Registration (CCR) prior to an award. The following FAR clauses apply: 52.212-1, Instructions to Offerors ?Commercial; 52.212-3, Offeror Representations and Certifications-Commercial Items; 52.212-4, Contract Terms and Conditions-Commercial Items and 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders-Commercial Items, 52.216-18, Ordering, 52.216-21 Requirements, 52.227-19 Commercial Computer Software-Restricted Rights, and DFARs 252.212-7001. DPAS rating is A7. Questions regarding this solicitation should be addressed to J. Hilton at Hilton@dmea.osd.mil. Offerors are due at 3:00PM on 22 Nov 2004. See Note 22.
- Place of Performance
- Address: Defense Microelectronics Activity, 4234 54th Street, McClellan, CA 95652-2100
- Record
- SN00702848-W 20041104/041102212223 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
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