MODIFICATION
66 -- Ion Beam Etch/Deposition System
- Notice Date
- 7/22/2004
- Notice Type
- Modification
- NAICS
- 334513
— Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables
- Contracting Office
- Department of Commerce, National Oceanic and Atmospheric Administration (NOAA), Mountain Administrative Support Center, 325 Broadway - MC3, Boulder, CO, 80305-3328
- ZIP Code
- 80305-3328
- Solicitation Number
- RA1341-04-RP-4025
- Response Due
- 8/16/2004
- Archive Date
- 10/1/2004
- Point of Contact
- Jan Clark, Contract Specialist, Phone (303) 497-6320, Fax (303) 497-3163,
- E-Mail Address
-
jan.clark@noaa.gov
- Description
- The purpose of this amendment no. 0002 to Solicitation RA1341-04-RP-4025 is to provide the following for informational purposes only. The hour and date previously specified for receipt of offers is NOT extended. Offers must acknowledge receipt of this Amendment prior to the hour and date specified in the solicitation/synopsis or as amended by (a) acknowledging receipt of this amendment on each copy of its offer submitted or by separate letter, fax, or email which includes a reference to the solicitation and amendment number. FAILURE OF YOUR CKNOWLEDGEMENT TO BE RECEIVED AT THE PLACE DESIGNATED FOR THE RECEIPT OF OFFERS PIRIOR TO THE HOUR AND DATE SPECIFIED MAY RESULT IN REJECTION OF YOUR OFFER. Q1: Regarding DESCRIPTION, section 1.5 and 2.2, a tilting or variable-incidence-angle stage is called for. How necessary is the variation in ion incidence angle from a process, materials and/or device point-of-view? Our company can offer variable angle, but we also can offer a new, much more capable multi-target alloy (or single material)co-sputtering deposition system that does have ion etch capability, but only at normal incidence to the stage. If the ion etching is to be used mainly for pre-cleaning the substrate and for straight, physical sputtering for material removal, then this kind of system might be a cost-effective and high-performance choice. This kind of system has a load lock as a standard option. On the other hand, if the devices being fabricated require sloping sidewalls or high aspect ratio trenches to be etched, then variable-angle ion etching might be required. Please advise. A: Variable incidence for etch is absolutely required. This feature allows etch profiles to be precisely tuned and can be used to minimize edge redeposition. Further, we require low-incidence etching for planarization processes. Q2: Is it permissible for one vendor to submit two proposals/quotations? We could propose both a) a system with variable angle stage but expensive loadlock and b) a system with fixed angle stage but cost-effective loadlock. Then NOAA could look at the full specs and price on both and make a decision. Is this acceptable? You may submit more than one proposal. However, one must be submitted in response to our specified requirement and the other must be designated as an "alternate." However, the Government requires a variable angle stage. The load lock options are to be quoted separately. EMAILADD: MASC.Solicitation@noaa.gov EMAILDESC: NOAA, MASC Acquisition Management Division
- Place of Performance
- Address: 325 Broadway, Boulder, CO
- Zip Code: 80305-3328
- Country: US
- Zip Code: 80305-3328
- Record
- SN00628369-W 20040724/040722211756 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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