MODIFICATION
66 -- Magnetron Sputter Deposition System
- Notice Date
- 6/6/2003
- Notice Type
- Modification
- Contracting Office
- Department of the Navy, Office of Naval Research, Naval Research Laboratory, 4555 Overlook Ave. S.W., Washington, DC, 20375
- ZIP Code
- 20375
- Solicitation Number
- N00173-03-R-MS04
- Response Due
- 6/12/2003
- Archive Date
- 5/15/2004
- Point of Contact
- Mary Sandy, Contract Specialist, Phone 202-767-3710, Fax 202-767-0430,
- E-Mail Address
-
sandy@contracts.nrl.navy.mil
- Description
- The purpose of this modification is to answer questions from potential offerors. Question 1: Are they looking for a single wafer tool or a batch tool with different sputter sources built in? Answer 1: NRL requires a system that has built in targets and is capable of single wafer depositions with the wafer located centrally between the targets (confocal deposition) and also capable of batch processing (wafers rotated directly under the targets. Question 2: Concerning N00173-03-R-MS04 for a Magnetron Sputter Deposition System. Please confirm that only small business concerns can bid on this contract. Will this possibly change? Answer 2: The NRL Deputy of Small Business made a determination that two or more small businesses could provide this item, therefore it was set aside for small business in accordance with FAR 19.502-2 b (1). Question 3: Is the load lock chamber to have manual or automatic substrate transfer? Answer 3: A manual transfer is required. Question 4: Please define the magnetic actuator on the load lock chamber. Answer 4: The magnetic actuator is an external magnet, which couples to the magnetic material of the sample transfer arm, which is under vacuum. This permits movement of the transfer arm from outside the vacuum system. Question 5: Can the substrates be mounted in carriers? If so, any preference of material? Answer 5: The substrates can be mounted on carriers. The material must be 316 or 304 stainless steel. Question 6: Is the load lock chamber to hold all four, 4" substrates at one time, or are the substrates loaded one at a time? Answer 6: Either way is acceptable. Question 7: Is an additional high vacuum port required on the process chamber to fit one of the optional turbo pumps? Answer 7: No, an additional high vacuum port is not required. Question 8: If option 4 is not ordered, is (sputtering) process pressure to be controlled upstream via MFC with the gate valve in a fixed position? Answer 8: Yes. Question 9: What material will be used to demonstrate film thickness uniformity? Answer 9: The following material will be used to demonstrate film thickness uniformity: Cu, Si3N4, SiO2, and Al. Question 10: Is IR heating via quartz lamps the desired method of heating the substrates? Answer 10: Yes, IR heating via quartz lamps is the desired method of heating the substrates. Question 11: Is a deposition rate controller required? If so, will it be used to control deposition rate & total thickness, how many sensors? Any preferred brand? Answer 11: A deposition rate controller is not required. Question 12: Regarding option 14, does this refer to the planetary assembly? If so, are we to propose this feature as one that can be added later, or if it is ordered, can it be integral with the planetary assembly. Answer 12: Yes option 14 refers to the planetary and yes it can be integral to the planetary assembly. Question 13: How many sputtering, bias / etch power supplies are to be provided with the base system? Answer 13: Two are required for the base system. One RF-VII 300W power supply & ATN-5 tuning network or equivalent for etch and / or sputtering and one ENI RPG-50 or equivalent for sputtering. Question 14: The specifications define a RF-VII 300W power supply & ATN-5 tuning network - is this for bias / etch only? Answer 14: The RF-VII 300W power supply & ATN-5 tuning network will be used for etch and / or sputtering. Refer to the specification Section G, 2.c. of the combined synopsis/solicitation. Question 15: Is the RPG-50 for sputtering only? Answer 15: Yes, the RPG-50 is for sputtering only. Question 16: Which model MDX series DC power supply is required? Answer 16: As an option an Advanced Energy MDX-1K is required. Question 17: Is 208VAC, 3-phase power available? Answer 17: Yes, 208VAC, 3-phase power is available. Question 18: Regarding the process chamber, under item 2 f) One heater power port and one heater water-cooling port, please clarify the requirements for the "heater water-cooling port". Answer 18: There must be an electrical feed through for powering the heater and thermocouple feed throughs for temperature readout and also fluid feed throughs for water supply for cooling the substrate.
- Place of Performance
- Address: NRL
- Record
- SN00341963-W 20030608/030606213620 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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