SOLICITATION NOTICE
A -- Harsh Environment Robust Micromechanical Technology (HERMIT)
- Notice Date
- 2/4/2003
- Notice Type
- Solicitation Notice
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, VA, 22203-1714
- ZIP Code
- 22203-1714
- Solicitation Number
- BAA03-11
- Archive Date
- 2/4/2004
- Point of Contact
- Clark Nguyen, Program Manager, MTO, Phone 5712184586, Fax 7036962206,
- E-Mail Address
-
cnguyen@darpa.mil
- Description
- Defense Advanced Research Projects Agency (DARPA), Contracts Management Office (CMO), 3701 North Fairfax Drive, Arlington, VA 22203-1714. A - HARSH ENVIRONMENT ROBUST MICROMECHANICAL TECHNOLOGY, SOL BAA 03-11, DUE 032803, POC DR. CLARK T.-C. NGUYEN, DARPA/MTO, FAX (571) 218-4556 PROGRAM OBJECTIVES AND DESCRIPTION The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of Harsh Environment Robust Micromechanical Technology (HERMIT). Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvement to the existing state-of-practice. DARPA seeks innovative proposals in the area of microelectromechanical systems (MEMS) implementations of HERMIT, with the ultimate objective being the realization of micromechanical devices capable of operating under harsh conditions-e.g., under large temperature excursions, large power throughputs, high g-forces, presence of corrosive substances, etc.-while maintaining unprecedented performance, stability, and lifetime. HERMIT implementations that result in long storage lifetimes for micromechanical devices are also desired. Although HERMIT realizations of micromechanical RF switches are of particular interest-especially for reliable operation over several billions of cycles, where sizable power throughputs across an impacting interface constitute a harsh operational environment-implementations for vibrating resonator frequency reference elements, gyroscopes, accelerometers, and other DoD-relevant MEMS devices, that attain order of magnitude improvements over the state-of-practice, are also desired. The two HERMIT implementation approaches of most interest are: (1) wafer-level encapsulation or packaging strategies based on MEMS technology that isolate a micromechanical device from its surroundings while maintaining a desired environment via passive or active control; or (2) material and design engineering strategies that enhance the robustness of a micromechanical device and render it impervious to its environment, with or without a package (if possible). Ultra-small size (on the order of chip-scale) and low power are paramount for any proposed approach. In addition, approaches that harness small size or micro-scale properties to attain better performance (e.g., lower power) would be of particular interest. Research topics and activities relevant to the implementation of HERMIT might include, but are not limited to: (1) modular technologies for low-cost wafer-level packaging; (2) strategies for micro-scale environmental control; (3) novel designs that eliminate failure mechanisms and suppress susceptibility to environmental perturbations; (4) understanding the physics of failure pursuant to identifying accelerated lifetime test procedures for both devices and packages (if used); (5) surface physics studies, perhaps pursuant to development of surface passivation treatments; (6) engineering of micromachinable structural and dielectric materials, including alloying; (7) in situ repair or recovery methods; (8) boardless integration of micromechanics and packages with control circuitry; (9) micromechanical isolation technology, such as oven control or microphonic damping networks; and (10) temperature independent design. HERMIT is ultimately expected to yield micromechanical devices with unprecedented performance and stability specifications, such as (but not limited to): (1) Micromechanical RF switches with less than 0.3 dB of on-state insertion loss at Ka-band (27-40 GHz) and capable of passing up to one watt of power while switching over more than 100 billion cycles, with little or no susceptibility to radiation or temperature excursions over the military range; (2) Vibrating micromechanical resonators with frequencies greater than 100 MHz, Q's exceeding 10,000, fractional frequency temperature stabilities better than 0.01 ppm over the military range (or wider), survivability under more than 20,000 g of acceleration, and aging rates less than 0.5 ppm/year, all with less than 5 mW of power consumption. (3) Micromechanical gyroscopes with bias stabilities better than 0.1 deg/hr maintained over the military temperature range and with less than 0.3 deg/hr drift after 20,000 g of acceleration, all with less than 5 mW of power consumption. Note that the above are merely examples meant to provide rough order of magnitude descriptions of what constitutes "substantial performance and stability improvements", and are not to be construed as complete, nor as rigid program specifications. HERMIT-enabled devices with characteristics similar to the above and achieved via low cost, batch fabrication methods are expected to enable a myriad of strategic capabilities. In particular, reliable low-loss micromechanical switches will make possible small, low-power true-time delay units for phased array antennas used in radars, as well as reconfigurable filters and antenna networks at microwave and higher frequencies. HERMIT-enabled vibrating micromechanical resonators with long-term stabilities approaching that of atomic clocks, Q's and power handling levels sufficient for excellent short-term stability, and frequencies exceeding that of conventional ultra-high-Q tanks (e.g., quartz crystals), will enable single-chip synthesizers for military radar and communications with exceptional close-to-carrier phase noise performance. Timing-critical applications, such as military GPS and secure communication devices, also stand to benefit enormously from the ultra-stable frequency output of such devices. Gyroscopes with tactical- to navigation-grade bias stabilities will be instrumental in enabling guided munitions and self-navigating micro-air vehicles, as well as an assortment of other small, autonomous maneuvering devices. In addition, any smart packaging technologies developed under this program stand to substantially benefit a much wider set of MEMS devices in both sheer performance and reliability. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 03-11 Proposer Information Pamphlet referenced below. DARPA strongly encourages well-coordinated, interdisciplinary research and development activities that take into consideration all significant and relevant engineering tradeoffs and optimizations. Teaming among academic, industrial and/or government partners is encouraged, and it is anticipated that the contributions of the team members are complementary as well as essential to the critical path of the research plan. A technology insertion plan is encouraged and research that holds promise of insertion into Department of Defense (DoD) relevance is of great interest. PROGRAM SCOPE The Harsh Environment Robust Micromechanical Technology Program will consist of a Phase I effort (18 months) followed by an optional Phase II (18 months) and Phase III (18 months) for those efforts that appear to have the greatest potential for production, insertion, transition or overall benefit to DoD. Awards are expected to be made during the third quarter of fiscal year 2003. Organizations wishing to participate in Phase II and Phase III should include them as options in their proposal (separate options for each phase). Multiple awards are anticipated. Collaborative efforts/teaming are strongly encouraged. A web site-http://teaming.sysplan.com/HERMIT-BAA-03-11/-has been established to facilitate formation of teaming arrangements between interested parties. Specific content, communications, networking, and team formation are the sole responsibility of the participants. Neither DARPA nor the Department of Defense (DoD) endorses the destination web site or the information and organizations contained therein, nor does DARPA or the DoD exercise any responsibility at the destination. This web site is provided consistent with the stated purpose of this BAA. Although teamed efforts are strongly encouraged, the program will also support some very innovative individual investigator efforts. Cost sharing is not required and is not an evaluation criterion, but is encouraged where there is a reasonable probability of a potential commercial application related to the proposed research and development effort. Questions concerning this BAA may be directed to the technical POC for this effort, Dr. Clark T.-C. Nguyen, phone: (571) 218-4586, fax: (571) 218-4556, electronic mail: cnguyen@darpa.mil GENERAL INFORMATION Proposers must obtain a pamphlet entitled "BAA 03-11, Harsh Environment Robust Micromechanical Technology, Proposer Information Pamphlet" which provides further information on Harsh Environment Robust Micromechanical Technology, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the FedBizOpps website: http://www.fedbizopps.gov/, World Wide Web (WWW) at URL http://www.darpa.mil/ or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and seven (7) copies of the proposal abstract and 2 electronic copies (i.e., 2 separate disks) of the abstract [in PDF (preferred), or MS-Word readable, each on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB) diskette, a single 100 MB Iomega Zip (registered) disk, or a CD-ROM] should be submitted. Each disk must be clearly labeled with BAA 03-11, proposer organization, proposal title (short title recommended), and Copy __ of 2. The proposal abstract (original and designated number of hard and electronic copies) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 03-11) on or before 4:00 p.m., local time, Friday, February 28, 2003. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and seven (7) copies of the full proposal and 2 electronic copies (i.e., 2 separate disks) of the full proposal [in PDF (preferred), or MS-Word readable, each on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB) diskette, a single 100 MB Iomega Zip (registered) disk, or a CD-ROM]. Each disk must be clearly labeled with BAA 03-11, proposer organization, proposal title (short title recommended), and Copy __ of 2. The full proposal (original and designated number of hard and electronic copies) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 03-11) on or before 4:00 p.m., local time, Friday, March 28, 2003, in order to be considered during the initial round of selections; however, proposals received after this deadline may be received and evaluated up to one year from date of posting on FedBizOpps. Full proposals submitted after the due date specified in the BAA or due date otherwise specified by DARPA after review of proposal abstracts may be selected contingent upon the availability of funds. This notice, in conjunction with the BAA 03-11 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Input on technical aspects of the proposals may be solicited by DARPA from non-Government consultants/experts who are bound by appropriate non-disclosure requirements. Non-Government technical consultants/experts will not have access to proposals that are labeled by their offerors as "Government Only". Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU/ MI participation due to the impracticality of reserving discrete or severable areas of research in Harsh Environment Robust Micromechanical Technology. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 03-11. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/MTO, BAA 03-11), Electronic Mail: BAA03-11@darpa.mil Mail: DARPA/MTO, ATTN: BAA 03-11 3701 North Fairfax Drive Arlington, VA 22203-1714 This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area.
- Record
- SN00253079-W 20030206/030204213734 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
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